BINDEMITTEL UND VERFAHREN ZU DESSEN HERSTELLUNG

The adhesive for producing plywood boards, chipboards and fibreboards and the like, which contains, as main components, phenol formaldehyde resin and lignin derivatives fractionated according to molecular weight, does not, as in the main patent, need to contain only those lignin derivatives of which...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	G.,FORSS,KAJ, G.M. FUHRMANN,AGNETA
Format:	Patent
Sprache:	ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The adhesive for producing plywood boards, chipboards and fibreboards and the like, which contains, as main components, phenol formaldehyde resin and lignin derivatives fractionated according to molecular weight, does not, as in the main patent, need to contain only those lignin derivatives of which at least 50% by weight have a molecular weight of over 5000. It is rather sufficient, in order to obtain weather-resistant adhesives of the aforementioned kind, if at least 35% by weight have a molecular weight of over 5000. This simplifies the production considerably.