Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle

At least one of reducing agents is released as gas after evaporation of the vehicle in soldering process, esp. for printed circuits, in which a flux, consisting of a vehicle, pref. EtOH, and a reducing agemt, pref. formalin, dissolved in vehicle, is applied, before soldering, to positions to be sold...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KUENZIG, HERBERT, 8750 ASCHAFFENBURG
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	KUENZIG, HERBERT, 8750 ASCHAFFENBURG
description	At least one of reducing agents is released as gas after evaporation of the vehicle in soldering process, esp. for printed circuits, in which a flux, consisting of a vehicle, pref. EtOH, and a reducing agemt, pref. formalin, dissolved in vehicle, is applied, before soldering, to positions to be soldered, and where vehicle is evaporated by heat on soldering and the metal oxides and hydroxides are partly reduced and rinsed off. Surface tension of solder may be controlled by providing a higher mol wt. organic halogen-free cpd., esp. succinic anhydride. Pref. flux contains 100 cc 96% EtOH, 0.2 cc formalin (35% HCHO) and 1.5 g succinic acid. No residues are left and bubble inclusions are not formed.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE2238874A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE2238874A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE2238874A13</originalsourceid><addsrcrecordid>eNqNTsEKwjAU28WDqP_wfmAHN8FdRSfe9S6PNquF0pb2dfj5drAP8BCSkASybeZncBrJekPIkWJVAk3KJlWsZGqp5CWcXPmSCl4MzfhY5UDsNSXoopacDbxU68C57jmTqeBJkAgzx5BYlt463jebiV3GYeVdQ_fxdX20iOFdj7CCh7xvY9f1w3A-XY79H5UfbqhE4g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle</title><source>esp@cenet</source><creator>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</creator><creatorcontrib>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</creatorcontrib><description>At least one of reducing agents is released as gas after evaporation of the vehicle in soldering process, esp. for printed circuits, in which a flux, consisting of a vehicle, pref. EtOH, and a reducing agemt, pref. formalin, dissolved in vehicle, is applied, before soldering, to positions to be soldered, and where vehicle is evaporated by heat on soldering and the metal oxides and hydroxides are partly reduced and rinsed off. Surface tension of solder may be controlled by providing a higher mol wt. organic halogen-free cpd., esp. succinic anhydride. Pref. flux contains 100 cc 96% EtOH, 0.2 cc formalin (35% HCHO) and 1.5 g succinic acid. No residues are left and bubble inclusions are not formed.</description><language>eng ; ger</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1974</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19740221&DB=EPODOC&CC=DE&NR=2238874A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19740221&DB=EPODOC&CC=DE&NR=2238874A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</creatorcontrib><title>Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle</title><description>At least one of reducing agents is released as gas after evaporation of the vehicle in soldering process, esp. for printed circuits, in which a flux, consisting of a vehicle, pref. EtOH, and a reducing agemt, pref. formalin, dissolved in vehicle, is applied, before soldering, to positions to be soldered, and where vehicle is evaporated by heat on soldering and the metal oxides and hydroxides are partly reduced and rinsed off. Surface tension of solder may be controlled by providing a higher mol wt. organic halogen-free cpd., esp. succinic anhydride. Pref. flux contains 100 cc 96% EtOH, 0.2 cc formalin (35% HCHO) and 1.5 g succinic acid. No residues are left and bubble inclusions are not formed.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1974</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNTsEKwjAU28WDqP_wfmAHN8FdRSfe9S6PNquF0pb2dfj5drAP8BCSkASybeZncBrJekPIkWJVAk3KJlWsZGqp5CWcXPmSCl4MzfhY5UDsNSXoopacDbxU68C57jmTqeBJkAgzx5BYlt463jebiV3GYeVdQ_fxdX20iOFdj7CCh7xvY9f1w3A-XY79H5UfbqhE4g</recordid><startdate>19740221</startdate><enddate>19740221</enddate><creator>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</creator><scope>EVB</scope></search><sort><creationdate>19740221</creationdate><title>Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle</title><author>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE2238874A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1974</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUENZIG, HERBERT, 8750 ASCHAFFENBURG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle</title><date>1974-02-21</date><risdate>1974</risdate><abstract>At least one of reducing agents is released as gas after evaporation of the vehicle in soldering process, esp. for printed circuits, in which a flux, consisting of a vehicle, pref. EtOH, and a reducing agemt, pref. formalin, dissolved in vehicle, is applied, before soldering, to positions to be soldered, and where vehicle is evaporated by heat on soldering and the metal oxides and hydroxides are partly reduced and rinsed off. Surface tension of solder may be controlled by providing a higher mol wt. organic halogen-free cpd., esp. succinic anhydride. Pref. flux contains 100 cc 96% EtOH, 0.2 cc formalin (35% HCHO) and 1.5 g succinic acid. No residues are left and bubble inclusions are not formed.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; ger
recordid	cdi_epo_espacenet_DE2238874A1
source	esp@cenet
subjects	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	Soldering esp printed circuits - using flux contg vehicle and reducing agent released as gas after evaporating vehicle
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T14%3A11%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUENZIG,%20HERBERT,%208750%20ASCHAFFENBURG&rft.date=1974-02-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE2238874A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true