Direkte Abscheidung von Palladium

The present invention is directed to a process for forming a layer of palladium on a substrate, comprising: preparing a solution of a palladium precursor, wherein the palladium precursor consists ofPd(OOCR1)m(OOCR2)nwherein R1 is hydrogen, alkyl, alkenyl, alkynyl, -R3COOH, alkyl from 1 to 5 carbons...

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Hauptverfasser: NARANG, SUBHASH C, SHARMA, SUNITY KUMAR, NIGAM, ASUTOSH, BHASIN, KULDIP KUMAR
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creator NARANG, SUBHASH C
SHARMA, SUNITY KUMAR
NIGAM, ASUTOSH
BHASIN, KULDIP KUMAR
description The present invention is directed to a process for forming a layer of palladium on a substrate, comprising: preparing a solution of a palladium precursor, wherein the palladium precursor consists ofPd(OOCR1)m(OOCR2)nwherein R1 is hydrogen, alkyl, alkenyl, alkynyl, -R3COOH, alkyl from 1 to 5 carbons substituted with one or two hydroxyl groups, R2 is hydrogen, alkyl, alkenyl, alkynyl, -R3COOH, alkyl from 1 to 5 carbon atoms substituted with one or two hydroxyl groups, -CHO, R3 is alkyl, and alkyl groups from 1 to 5 carbon atoms substituted with one or two hydroxyl groups m and n are real numbers or fractions, and m+n=2; applying the palladium precursor to the surface of the substrate; decomposing the palladium precursor by subjecting the precursor to heat.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title Direkte Abscheidung von Palladium
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