Lötmetalllegierung und Halbleiterbauteil
Lötmetalllegierung (3), die 5 bis 15 Masse-% Sb, 3 bis 8 Masse-% Cu, 0,01 bis unter 0,1 Masse-% Ni, 0,5 bis 5 Masse-% In und einen Rest enthält, der Sn und unvermeidbare Fremdstoffe umfasst. A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 t...
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| creator | Maeda, Akira Yamada, Akira Otsu, Kenji |
| description | Lötmetalllegierung (3), die 5 bis 15 Masse-% Sb, 3 bis 8 Masse-% Cu, 0,01 bis unter 0,1 Masse-% Ni, 0,5 bis 5 Masse-% In und einen Rest enthält, der Sn und unvermeidbare Fremdstoffe umfasst.
A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained. |
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A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained.</description><language>ger</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240523&DB=EPODOC&CC=DE&NR=112009002570B4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240523&DB=EPODOC&CC=DE&NR=112009002570B4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Maeda, Akira</creatorcontrib><creatorcontrib>Yamada, Akira</creatorcontrib><creatorcontrib>Otsu, Kenji</creatorcontrib><title>Lötmetalllegierung und Halbleiterbauteil</title><description>Lötmetalllegierung (3), die 5 bis 15 Masse-% Sb, 3 bis 8 Masse-% Cu, 0,01 bis unter 0,1 Masse-% Ni, 0,5 bis 5 Masse-% In und einen Rest enthält, der Sn und unvermeidbare Fremdstoffe umfasst.
A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0ObytJDe1JDEnJyc1PTO1qDQvXaE0L0XBIzEnKSc1syS1KCmxtCQ1M4eHgTUtMac4lRdKczOourmGOHvophbkx6cWFyQmp-allsS7uBoaGhkYWBoYGJmaGziZGBOrDgDf5Ctr</recordid><startdate>20240523</startdate><enddate>20240523</enddate><creator>Maeda, Akira</creator><creator>Yamada, Akira</creator><creator>Otsu, Kenji</creator><scope>EVB</scope></search><sort><creationdate>20240523</creationdate><title>Lötmetalllegierung und Halbleiterbauteil</title><author>Maeda, Akira ; Yamada, Akira ; Otsu, Kenji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE112009002570B43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>2024</creationdate><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Maeda, Akira</creatorcontrib><creatorcontrib>Yamada, Akira</creatorcontrib><creatorcontrib>Otsu, Kenji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Maeda, Akira</au><au>Yamada, Akira</au><au>Otsu, Kenji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Lötmetalllegierung und Halbleiterbauteil</title><date>2024-05-23</date><risdate>2024</risdate><abstract>Lötmetalllegierung (3), die 5 bis 15 Masse-% Sb, 3 bis 8 Masse-% Cu, 0,01 bis unter 0,1 Masse-% Ni, 0,5 bis 5 Masse-% In und einen Rest enthält, der Sn und unvermeidbare Fremdstoffe umfasst.
A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | Lötmetalllegierung und Halbleiterbauteil |
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