Integriertes Halbleiter-Outline-Gehäuse

A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PC...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JOB DORAISAMY, STANLEY, YONG, WAE CHET
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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