Chip-Wendevorrichtung und Chip-Wendeverfahren sowie Chip-Montagevorrichtung und Chip-Montageverfahren

In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAKINO, YOICHI, KABESHITA, AKIRA
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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