Elektronikbauteilleiterplatte und Verfahren zu deren Herstellung

An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is sliding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAKINO, DAISUKE, MIZUNO, SHINJI, SHINOKI, TAKASHI, NAKAGOME, KAZUTAKA, MITSUI, KOJI, SUZUKI, SHINICHI, FUKUDA, NAOKI, MORITA, KOZO, YANOSHITA, KATSUTOSHI
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS
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