Verfahren zum Glätten und Polieren oder zum Strukturieren von Oberflächen mit Laserstrahlung

The invention relates to a method for smoothing and polishing or structuring surfaces by means of laser machining. According to said method, the surface that is to be smoothed or polished is remelted once or several times in a row with first processing parameters along a processing path by means of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WISSENBACH, KURT, WILLENBORG, EDGAR, KIEDROWSKI, THOMAS
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:The invention relates to a method for smoothing and polishing or structuring surfaces by means of laser machining. According to said method, the surface that is to be smoothed or polished is remelted once or several times in a row with first processing parameters along a processing path by means of laser radiation until reaching a first remelting depth which is greater than the depth of structures of the surface that is to be smoothed or structured while being