Halbleitervorrichtung und Verfahren zum Herstellen derselben

Halbleitervorrichtung und Verfahren zum Herstellen derselben

In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator f...

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Hauptverfasser: HOSONO, MASAYUKI, KAWANOBE, TADASHI, KAMEYAMA, YASUHARU, SHIBATA, AKIJI, KOMIYA, KAZUMOTO
Format: Patent
Sprache:ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HOSONO, MASAYUKI
KAWANOBE, TADASHI
KAMEYAMA, YASUHARU
SHIBATA, AKIJI
KOMIYA, KAZUMOTO
description In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Halbleitervorrichtung und Verfahren zum Herstellen derselben
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