Channeling vacuum process systems, comprises feeding air in a lock chamber of the vacuum process system until pressure is equally large within and outside of the lock chamber, and opening the lock chamber to atmosphere

The method comprises feeding air in a lock chamber of a vacuum process system until the pressure is equally large within and outside of the lock chamber, where air admitted in the lock chamber has a lower water content with respect to the ambient air, opening the lock chamber to the atmosphere, intr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BOTZLER, PETER, GEHLERT, MARKUS, KRAUSE, JOCHEN
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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