Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte
Verfahren zur Herstellung einer gedruckten Leiterplatte, umfassend die Stufen:Aufbringen einer photo- und wärmehärtenden Harzzusammensetzung (105) auf eine Oberfläche und das Durchgangsloch (103) einer gedruckten Leiterplatte mit dem Durchgangsloch (103);nacheinander erfolgendes Durchführen der folg...
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| creator | Koga, Yukihiro Kitamura, Kazunori Fujitsu, Shouji Sato, Kiyoshi |
| description | Verfahren zur Herstellung einer gedruckten Leiterplatte, umfassend die Stufen:Aufbringen einer photo- und wärmehärtenden Harzzusammensetzung (105) auf eine Oberfläche und das Durchgangsloch (103) einer gedruckten Leiterplatte mit dem Durchgangsloch (103);nacheinander erfolgendes Durchführen der folgenden Stufen (1) und (2);Aufbringen der photo- und wärmehärtenden Harzzusammensetzung (105) auf die andere Oberfläche der gedruckten Leiterplatte; undnacheinander erfolgendes Durchführen der folgenden Stufen (1) bis (3):(1) Abflachen oder Abgleichen der Oberfläche des aufgebrachten Harzes mit einer Druckwalze (107, 108);(2) Photohärten des aufgebrachten Harzes; und(3) Wärmehärten des photogehärteten Harzes.
PROBLEM TO BE SOLVED: To provide a method for manufacturing a planarized resin-coated printed wiring board without the need of polishing, both surfaces of which have been extremely highly planarized, the thickness of which is constant all over the printed wiring board, and which is excellent in the mounting stability and impedance characteristic of parts; and a multilayer printed wiring board useful as an internal layer that is manufactured by such a printed wiring board and both surfaces of which have been extremely highly planarized. SOLUTION: The method for manufacturing a printed wiring board, in which a photo/thermal hardening resin composite is applied to one of the surfaces of a printed wiring board having a through-hole and the through-hole. After the following steps (1) and (2) are carried out sequentially; the photo/thermal hardening resin composite is applied to the other surface of the printed wiring board, and the following steps (1) to (3) are carried out sequentially for planarizing the surface to which resin is applied (step 1), for photo-hardening the resin to be applied (step 2), and for thermal-hardening the photo hardening resin (step 3). COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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PROBLEM TO BE SOLVED: To provide a method for manufacturing a planarized resin-coated printed wiring board without the need of polishing, both surfaces of which have been extremely highly planarized, the thickness of which is constant all over the printed wiring board, and which is excellent in the mounting stability and impedance characteristic of parts; and a multilayer printed wiring board useful as an internal layer that is manufactured by such a printed wiring board and both surfaces of which have been extremely highly planarized. SOLUTION: The method for manufacturing a printed wiring board, in which a photo/thermal hardening resin composite is applied to one of the surfaces of a printed wiring board having a through-hole and the through-hole. After the following steps (1) and (2) are carried out sequentially; the photo/thermal hardening resin composite is applied to the other surface of the printed wiring board, and the following steps (1) to (3) are carried out sequentially for planarizing the surface to which resin is applied (step 1), for photo-hardening the resin to be applied (step 2), and for thermal-hardening the photo hardening resin (step 3). COPYRIGHT: (C)2007,JPO&INPIT</description><language>ger</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200709&DB=EPODOC&CC=DE&NR=102006037273B4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200709&DB=EPODOC&CC=DE&NR=102006037273B4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Koga, Yukihiro</creatorcontrib><creatorcontrib>Kitamura, Kazunori</creatorcontrib><creatorcontrib>Fujitsu, Shouji</creatorcontrib><creatorcontrib>Sato, Kiyoshi</creatorcontrib><title>Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte</title><description>Verfahren zur Herstellung einer gedruckten Leiterplatte, umfassend die Stufen:Aufbringen einer photo- und wärmehärtenden Harzzusammensetzung (105) auf eine Oberfläche und das Durchgangsloch (103) einer gedruckten Leiterplatte mit dem Durchgangsloch (103);nacheinander erfolgendes Durchführen der folgenden Stufen (1) und (2);Aufbringen der photo- und wärmehärtenden Harzzusammensetzung (105) auf die andere Oberfläche der gedruckten Leiterplatte; undnacheinander erfolgendes Durchführen der folgenden Stufen (1) bis (3):(1) Abflachen oder Abgleichen der Oberfläche des aufgebrachten Harzes mit einer Druckwalze (107, 108);(2) Photohärten des aufgebrachten Harzes; und(3) Wärmehärten des photogehärteten Harzes.
PROBLEM TO BE SOLVED: To provide a method for manufacturing a planarized resin-coated printed wiring board without the need of polishing, both surfaces of which have been extremely highly planarized, the thickness of which is constant all over the printed wiring board, and which is excellent in the mounting stability and impedance characteristic of parts; and a multilayer printed wiring board useful as an internal layer that is manufactured by such a printed wiring board and both surfaces of which have been extremely highly planarized. SOLUTION: The method for manufacturing a printed wiring board, in which a photo/thermal hardening resin composite is applied to one of the surfaces of a printed wiring board having a through-hole and the through-hole. After the following steps (1) and (2) are carried out sequentially; the photo/thermal hardening resin composite is applied to the other surface of the printed wiring board, and the following steps (1) to (3) are carried out sequentially for planarizing the surface to which resin is applied (step 1), for photo-hardening the resin to be applied (step 2), and for thermal-hardening the photo hardening resin (step 3). COPYRIGHT: (C)2007,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0TEpPTctJTM4oSdVRyM0sUfBILKpSSEotTs7IBAmWpCqkp6YUlSZnA1k-qZklqUUFOYklJak8DKxpiTnFqbxQmptB1c01xNlDN7UgPz61uCAxOTUvtSTexdXQwMjAwMzA2NzI3NjJxJhYdQCeATAp</recordid><startdate>20200709</startdate><enddate>20200709</enddate><creator>Koga, Yukihiro</creator><creator>Kitamura, Kazunori</creator><creator>Fujitsu, Shouji</creator><creator>Sato, Kiyoshi</creator><scope>EVB</scope></search><sort><creationdate>20200709</creationdate><title>Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte</title><author>Koga, Yukihiro ; Kitamura, Kazunori ; Fujitsu, Shouji ; Sato, Kiyoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE102006037273B43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>Koga, Yukihiro</creatorcontrib><creatorcontrib>Kitamura, Kazunori</creatorcontrib><creatorcontrib>Fujitsu, Shouji</creatorcontrib><creatorcontrib>Sato, Kiyoshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koga, Yukihiro</au><au>Kitamura, Kazunori</au><au>Fujitsu, Shouji</au><au>Sato, Kiyoshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte</title><date>2020-07-09</date><risdate>2020</risdate><abstract>Verfahren zur Herstellung einer gedruckten Leiterplatte, umfassend die Stufen:Aufbringen einer photo- und wärmehärtenden Harzzusammensetzung (105) auf eine Oberfläche und das Durchgangsloch (103) einer gedruckten Leiterplatte mit dem Durchgangsloch (103);nacheinander erfolgendes Durchführen der folgenden Stufen (1) und (2);Aufbringen der photo- und wärmehärtenden Harzzusammensetzung (105) auf die andere Oberfläche der gedruckten Leiterplatte; undnacheinander erfolgendes Durchführen der folgenden Stufen (1) bis (3):(1) Abflachen oder Abgleichen der Oberfläche des aufgebrachten Harzes mit einer Druckwalze (107, 108);(2) Photohärten des aufgebrachten Harzes; und(3) Wärmehärten des photogehärteten Harzes.
PROBLEM TO BE SOLVED: To provide a method for manufacturing a planarized resin-coated printed wiring board without the need of polishing, both surfaces of which have been extremely highly planarized, the thickness of which is constant all over the printed wiring board, and which is excellent in the mounting stability and impedance characteristic of parts; and a multilayer printed wiring board useful as an internal layer that is manufactured by such a printed wiring board and both surfaces of which have been extremely highly planarized. SOLUTION: The method for manufacturing a printed wiring board, in which a photo/thermal hardening resin composite is applied to one of the surfaces of a printed wiring board having a through-hole and the through-hole. After the following steps (1) and (2) are carried out sequentially; the photo/thermal hardening resin composite is applied to the other surface of the printed wiring board, and the following steps (1) to (3) are carried out sequentially for planarizing the surface to which resin is applied (step 1), for photo-hardening the resin to be applied (step 2), and for thermal-hardening the photo hardening resin (step 3). COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte |
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