Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material

The jointing material for filling the gaps (22) between sections (10, 12) of flooring material, e.g. chipboard or MDF planks, contains a super-absorbent expanding material. Fugenmaterial zum Einfügen in Fugen (22) von Bodenbelägen (10, 12), dadurch gekennzeichnet, dass das Fugenmaterial ein superabs...

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Hauptverfasser:	ALTHOFF, THORSTEN, KLEINSCHMIDT, NORBERT
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BUILDING CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS WALLS, e.g. PARTITIONS
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creator	ALTHOFF, THORSTEN KLEINSCHMIDT, NORBERT
description	The jointing material for filling the gaps (22) between sections (10, 12) of flooring material, e.g. chipboard or MDF planks, contains a super-absorbent expanding material. Fugenmaterial zum Einfügen in Fugen (22) von Bodenbelägen (10, 12), dadurch gekennzeichnet, dass das Fugenmaterial ein superabsorbierendes Quellmittel umfasst.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE102005058971A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE102005058971A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE102005058971A13</originalsourceid><addsrcrecordid>eNqNjDEKwkAQRdNYiHqHaew0JEpQS1GDCHb2MtnMJovrzLK7ojfxukawSGn14fHfGybvkxiOhhu4YyRv0IIWD9pY-4WxJWjQBagoPokYAqlohAOIBm1FfF-dAaVNCqo1rhL0NXSl874EZ5FvYQZKOKLp5PBw5OdYBfEVcQR6OeS6nxonA4020OS3o2RaHi6745ycXCk4VMQUr_tDni2yrMiK9WaVb_Plv78PF8tS2A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material</title><source>esp@cenet</source><creator>ALTHOFF, THORSTEN ; KLEINSCHMIDT, NORBERT</creator><creatorcontrib>ALTHOFF, THORSTEN ; KLEINSCHMIDT, NORBERT</creatorcontrib><description>The jointing material for filling the gaps (22) between sections (10, 12) of flooring material, e.g. chipboard or MDF planks, contains a super-absorbent expanding material. Fugenmaterial zum Einfügen in Fugen (22) von Bodenbelägen (10, 12), dadurch gekennzeichnet, dass das Fugenmaterial ein superabsorbierendes Quellmittel umfasst.</description><language>eng ; ger</language><subject>BUILDING ; CEILINGS ; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS ; FIXED CONSTRUCTIONS ; FLOORS ; GENERAL BUILDING CONSTRUCTIONS ; INSULATION OR OTHER PROTECTION OF BUILDINGS ; ROOFS ; WALLS, e.g. PARTITIONS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070614&DB=EPODOC&CC=DE&NR=102005058971A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070614&DB=EPODOC&CC=DE&NR=102005058971A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALTHOFF, THORSTEN</creatorcontrib><creatorcontrib>KLEINSCHMIDT, NORBERT</creatorcontrib><title>Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material</title><description>The jointing material for filling the gaps (22) between sections (10, 12) of flooring material, e.g. chipboard or MDF planks, contains a super-absorbent expanding material. Fugenmaterial zum Einfügen in Fugen (22) von Bodenbelägen (10, 12), dadurch gekennzeichnet, dass das Fugenmaterial ein superabsorbierendes Quellmittel umfasst.</description><subject>BUILDING</subject><subject>CEILINGS</subject><subject>FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS</subject><subject>FIXED CONSTRUCTIONS</subject><subject>FLOORS</subject><subject>GENERAL BUILDING CONSTRUCTIONS</subject><subject>INSULATION OR OTHER PROTECTION OF BUILDINGS</subject><subject>ROOFS</subject><subject>WALLS, e.g. PARTITIONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKwkAQRdNYiHqHaew0JEpQS1GDCHb2MtnMJovrzLK7ojfxukawSGn14fHfGybvkxiOhhu4YyRv0IIWD9pY-4WxJWjQBagoPokYAqlohAOIBm1FfF-dAaVNCqo1rhL0NXSl874EZ5FvYQZKOKLp5PBw5OdYBfEVcQR6OeS6nxonA4020OS3o2RaHi6745ycXCk4VMQUr_tDni2yrMiK9WaVb_Plv78PF8tS2A</recordid><startdate>20070614</startdate><enddate>20070614</enddate><creator>ALTHOFF, THORSTEN</creator><creator>KLEINSCHMIDT, NORBERT</creator><scope>EVB</scope></search><sort><creationdate>20070614</creationdate><title>Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material</title><author>ALTHOFF, THORSTEN ; KLEINSCHMIDT, NORBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE102005058971A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2007</creationdate><topic>BUILDING</topic><topic>CEILINGS</topic><topic>FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS</topic><topic>FIXED CONSTRUCTIONS</topic><topic>FLOORS</topic><topic>GENERAL BUILDING CONSTRUCTIONS</topic><topic>INSULATION OR OTHER PROTECTION OF BUILDINGS</topic><topic>ROOFS</topic><topic>WALLS, e.g. PARTITIONS</topic><toplevel>online_resources</toplevel><creatorcontrib>ALTHOFF, THORSTEN</creatorcontrib><creatorcontrib>KLEINSCHMIDT, NORBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALTHOFF, THORSTEN</au><au>KLEINSCHMIDT, NORBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material</title><date>2007-06-14</date><risdate>2007</risdate><abstract>The jointing material for filling the gaps (22) between sections (10, 12) of flooring material, e.g. chipboard or MDF planks, contains a super-absorbent expanding material. Fugenmaterial zum Einfügen in Fugen (22) von Bodenbelägen (10, 12), dadurch gekennzeichnet, dass das Fugenmaterial ein superabsorbierendes Quellmittel umfasst.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BUILDING CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS WALLS, e.g. PARTITIONS
title	Jointing material for filling the gaps between sections of flooring material, e.g. chipboard or MDF planks, contains super-absorbent expanding material
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