Halbleiterchipgehäuse mit Kühlvorrichtung
Die Erfindung bezieht sich auf ein Halbleiterchipgehäuse (1) mit Kühlvorrichtung, die insbesondere die Wärme schnell vom Halbleiterchip (11) wegführen kann, Störungen filtern kann und die Induktivität während des Betriebs reduzieren kann. A semiconductor chip package with cooling arrangement include...
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| creator | TU, FENG CHANG HU, CHIA CHIEH SHIEH, WEN LO LEU, WEN-LONG CHEN, HUI PIN HUANG, FU YU CHIANG, HUA WEN CHANG, HSUAN JUI HUANG, NING CHANG, CHUNG MING |
| description | Die Erfindung bezieht sich auf ein Halbleiterchipgehäuse (1) mit Kühlvorrichtung, die insbesondere die Wärme schnell vom Halbleiterchip (11) wegführen kann, Störungen filtern kann und die Induktivität während des Betriebs reduzieren kann.
A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance. |
| format | Patent |
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A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.</description><edition>7</edition><language>ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030227&DB=EPODOC&CC=DE&NR=10157299A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76292</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030227&DB=EPODOC&CC=DE&NR=10157299A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TU, FENG CHANG</creatorcontrib><creatorcontrib>HU, CHIA CHIEH</creatorcontrib><creatorcontrib>SHIEH, WEN LO</creatorcontrib><creatorcontrib>LEU, WEN-LONG</creatorcontrib><creatorcontrib>CHEN, HUI PIN</creatorcontrib><creatorcontrib>HUANG, FU YU</creatorcontrib><creatorcontrib>CHIANG, HUA WEN</creatorcontrib><creatorcontrib>CHANG, HSUAN JUI</creatorcontrib><creatorcontrib>HUANG, NING</creatorcontrib><creatorcontrib>CHANG, CHUNG MING</creatorcontrib><title>Halbleiterchipgehäuse mit Kühlvorrichtung</title><description>Die Erfindung bezieht sich auf ein Halbleiterchipgehäuse (1) mit Kühlvorrichtung, die insbesondere die Wärme schnell vom Halbleiterchip (11) wegführen kann, Störungen filtern kann und die Induktivität während des Betriebs reduzieren kann.
A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2SMxJyknNLEktSs7ILEhPzTi8pLQ4VSE3s0TB-_CejJyy_KKizOSMktK8dB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_iamhgaGpuZGnpaGhMjBoAQJErcw</recordid><startdate>20030227</startdate><enddate>20030227</enddate><creator>TU, FENG CHANG</creator><creator>HU, CHIA CHIEH</creator><creator>SHIEH, WEN LO</creator><creator>LEU, WEN-LONG</creator><creator>CHEN, HUI PIN</creator><creator>HUANG, FU YU</creator><creator>CHIANG, HUA WEN</creator><creator>CHANG, HSUAN JUI</creator><creator>HUANG, NING</creator><creator>CHANG, CHUNG MING</creator><scope>EVB</scope></search><sort><creationdate>20030227</creationdate><title>Halbleiterchipgehäuse mit Kühlvorrichtung</title><author>TU, FENG CHANG ; HU, CHIA CHIEH ; SHIEH, WEN LO ; LEU, WEN-LONG ; CHEN, HUI PIN ; HUANG, FU YU ; CHIANG, HUA WEN ; CHANG, HSUAN JUI ; HUANG, NING ; CHANG, CHUNG MING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE10157299A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TU, FENG CHANG</creatorcontrib><creatorcontrib>HU, CHIA CHIEH</creatorcontrib><creatorcontrib>SHIEH, WEN LO</creatorcontrib><creatorcontrib>LEU, WEN-LONG</creatorcontrib><creatorcontrib>CHEN, HUI PIN</creatorcontrib><creatorcontrib>HUANG, FU YU</creatorcontrib><creatorcontrib>CHIANG, HUA WEN</creatorcontrib><creatorcontrib>CHANG, HSUAN JUI</creatorcontrib><creatorcontrib>HUANG, NING</creatorcontrib><creatorcontrib>CHANG, CHUNG MING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TU, FENG CHANG</au><au>HU, CHIA CHIEH</au><au>SHIEH, WEN LO</au><au>LEU, WEN-LONG</au><au>CHEN, HUI PIN</au><au>HUANG, FU YU</au><au>CHIANG, HUA WEN</au><au>CHANG, HSUAN JUI</au><au>HUANG, NING</au><au>CHANG, CHUNG MING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Halbleiterchipgehäuse mit Kühlvorrichtung</title><date>2003-02-27</date><risdate>2003</risdate><abstract>Die Erfindung bezieht sich auf ein Halbleiterchipgehäuse (1) mit Kühlvorrichtung, die insbesondere die Wärme schnell vom Halbleiterchip (11) wegführen kann, Störungen filtern kann und die Induktivität während des Betriebs reduzieren kann.
A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Halbleiterchipgehäuse mit Kühlvorrichtung |
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