Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached
The cooling device has a cooling body (2) of thermally conductive material enclosing a hollow volume (20) for passing a flow of a fluid (200) through the body, two or more outer surface sections facing away from the hollow volume in different directions and to each of which one or more electronic co...
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| creator | WOLFGANG, ECKHARD SELIGER, NORBERT KOZLOWSKI, FRANK |
| description | The cooling device has a cooling body (2) of thermally conductive material enclosing a hollow volume (20) for passing a flow of a fluid (200) through the body, two or more outer surface sections facing away from the hollow volume in different directions and to each of which one or more electronic components (3) can be attached. AN Independent claim is also included for a cooling body for an inventive device.
Es ist eine Kühleinrichtung (1) zur Kühlung elektronischer Bauelemente (30), mit einem Kühlkörper (2) aus wärmeleitendem Material, der - einen vom wärmeleitenden Material umgebenen Hohlraum (20) zum Durchströmenlassen eines Fluids (200) durch den Kühlkörper (2) und - zwei oder mehr vom Hohlraum (20) abgekehrte und in voneinander verschiedene Richtungen (211, 212, 211', 212'; 213, 214, 213', 214') weisende äußere Oberflächenabschnitte (21) aufweist, an deren jedem je ein oder mehr zu kühlende elektronische Bauelemente (3) befestigt ist oder sind. |
| format | Patent |
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Es ist eine Kühleinrichtung (1) zur Kühlung elektronischer Bauelemente (30), mit einem Kühlkörper (2) aus wärmeleitendem Material, der - einen vom wärmeleitenden Material umgebenen Hohlraum (20) zum Durchströmenlassen eines Fluids (200) durch den Kühlkörper (2) und - zwei oder mehr vom Hohlraum (20) abgekehrte und in voneinander verschiedene Richtungen (211, 212, 211', 212'; 213, 214, 213', 214') weisende äußere Oberflächenabschnitte (21) aufweist, an deren jedem je ein oder mehr zu kühlende elektronische Bauelemente (3) befestigt ist oder sind.</description><edition>7</edition><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030403&DB=EPODOC&CC=DE&NR=10140328A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030403&DB=EPODOC&CC=DE&NR=10140328A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOLFGANG, ECKHARD</creatorcontrib><creatorcontrib>SELIGER, NORBERT</creatorcontrib><creatorcontrib>KOZLOWSKI, FRANK</creatorcontrib><title>Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached</title><description>The cooling device has a cooling body (2) of thermally conductive material enclosing a hollow volume (20) for passing a flow of a fluid (200) through the body, two or more outer surface sections facing away from the hollow volume in different directions and to each of which one or more electronic components (3) can be attached. AN Independent claim is also included for a cooling body for an inventive device.
Es ist eine Kühleinrichtung (1) zur Kühlung elektronischer Bauelemente (30), mit einem Kühlkörper (2) aus wärmeleitendem Material, der - einen vom wärmeleitenden Material umgebenen Hohlraum (20) zum Durchströmenlassen eines Fluids (200) durch den Kühlkörper (2) und - zwei oder mehr vom Hohlraum (20) abgekehrte und in voneinander verschiedene Richtungen (211, 212, 211', 212'; 213, 214, 213', 214') weisende äußere Oberflächenabschnitte (21) aufweist, an deren jedem je ein oder mehr zu kühlende elektronische Bauelemente (3) befestigt ist oder sind.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjr0KwjAUhbs4iPoOx01BobUOrlIrPoB7iemNDaS5JUlbfC8f0AgdHZzuufCdn3nyLpiNtk_UNGhJUOxAhmRwbLWE5LZjSzZ4NMKD-0AOvndKRNZHTLP1iN83QoziBeW4RcPG8IiBTd8StEWtlSIXc6Jyk22HwCAhG7DC2OgofjVv_BZSWDwIIoSIU71MZkoYT6vpLpL1tbwXtz11XJHv4jhLobqUWZod0_xwOmf5P8wHA2Fceg</recordid><startdate>20030403</startdate><enddate>20030403</enddate><creator>WOLFGANG, ECKHARD</creator><creator>SELIGER, NORBERT</creator><creator>KOZLOWSKI, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20030403</creationdate><title>Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached</title><author>WOLFGANG, ECKHARD ; SELIGER, NORBERT ; KOZLOWSKI, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE10140328A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WOLFGANG, ECKHARD</creatorcontrib><creatorcontrib>SELIGER, NORBERT</creatorcontrib><creatorcontrib>KOZLOWSKI, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOLFGANG, ECKHARD</au><au>SELIGER, NORBERT</au><au>KOZLOWSKI, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached</title><date>2003-04-03</date><risdate>2003</risdate><abstract>The cooling device has a cooling body (2) of thermally conductive material enclosing a hollow volume (20) for passing a flow of a fluid (200) through the body, two or more outer surface sections facing away from the hollow volume in different directions and to each of which one or more electronic components (3) can be attached. AN Independent claim is also included for a cooling body for an inventive device.
Es ist eine Kühleinrichtung (1) zur Kühlung elektronischer Bauelemente (30), mit einem Kühlkörper (2) aus wärmeleitendem Material, der - einen vom wärmeleitenden Material umgebenen Hohlraum (20) zum Durchströmenlassen eines Fluids (200) durch den Kühlkörper (2) und - zwei oder mehr vom Hohlraum (20) abgekehrte und in voneinander verschiedene Richtungen (211, 212, 211', 212'; 213, 214, 213', 214') weisende äußere Oberflächenabschnitte (21) aufweist, an deren jedem je ein oder mehr zu kühlende elektronische Bauelemente (3) befestigt ist oder sind.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached |
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