Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung

Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung

An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of s...

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Hauptverfasser: HEDLER, HARRY, WENNEMUTH, INGO
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HEDLER, HARRY
WENNEMUTH, INGO
description An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung
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