VERFAHREN ZUM ERHITZEN EINER DUENNEN OBERFLAECENSCHICHT EINES DICKEREN DIELEKTRISCHEN SUBSTRATES
In the lamination of thermoplastic polymer layers to substrates a thin surface layer of the substrate can be heated to improve adhesion without substantially heating the mass of the substrate by advancing the exposed surface of the thin layer in surface-conforming contact with a heated surface for 0...
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| creator | KINARD,RICHARD D.,US JONES,CHARLES B.,US |
| description | In the lamination of thermoplastic polymer layers to substrates a thin surface layer of the substrate can be heated to improve adhesion without substantially heating the mass of the substrate by advancing the exposed surface of the thin layer in surface-conforming contact with a heated surface for 0.1 to one second at an interface pressure of 0.1 to 5 kilograms per centimeter of substrate width, the heated surface having an initial temperature of 35 DEG -350 DEG C. |
| format | Patent |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | VERFAHREN ZUM ERHITZEN EINER DUENNEN OBERFLAECENSCHICHT EINES DICKEREN DIELEKTRISCHEN SUBSTRATES |
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