Polymer resin with adjustable viscosity and pH value for application of catalytic palladium to substrate, process of its preparation and its use
Polymerní pryskyřice obsahuje palladnatou sůl, karboxylové kyseliny nebo chlorid jako komplexotvorné činidlo, ve vodě rozpustný polymer obsahující hydroxylové nebo karboxylové skupiny, alkalickou sloučeninu a rozpouštědlo vybrané ze skupiny voda, methanol a ethanol. Při její přípravě se odděleně mís...
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| creator | SOUMILLION JEAN-PHILIPPE DELVAUX MARY-HLENE DUFUUR PASCALE SENDROWICZ HENRI DUPUIS OLIVIER MALNERO FERNANDEZ MARIE-CARMEN |
| description | Polymerní pryskyřice obsahuje palladnatou sůl, karboxylové kyseliny nebo chlorid jako komplexotvorné činidlo, ve vodě rozpustný polymer obsahující hydroxylové nebo karboxylové skupiny, alkalickou sloučeninu a rozpouštědlo vybrané ze skupiny voda, methanol a ethanol. Při její přípravě se odděleně mísí palladnatá sůl a komplexotvorné činidlo se dvěma třetinami rozpouštědla, polymer se zbývající třetinou rozpouštědla, načež se oba roztoky smísí a přidá se alkalická sloučenina pro úpravu pH. Polymerní pryskyřice je určena pro pokovování tištěných obvodů, elektromagnetických senzorů a dekorativních vzorů.ŕ
In the present invention there is disclosed a polymer resin containing a palladium salt, carboxylic acids or a chloride as a complex-forming agent, further water-soluble polymer containing hydroxyl or carboxyl groups, an alkali compound and a solvent being selected from a group comprising water, methanol and ethanol. The preparation process of the above indicated polymer resin there is mixed separately the palladium salt and the complex-forming agent with two thirds of the solvent, the polymer with the remaining third of the solvent, whereupon both the solutions are mixed together and the alkali compound is added for adjusting pH value thereof. So prepared polymer resin is intended for metal coating printed circuits, electromagnetic sensors and decorative patterns. |
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In the present invention there is disclosed a polymer resin containing a palladium salt, carboxylic acids or a chloride as a complex-forming agent, further water-soluble polymer containing hydroxyl or carboxyl groups, an alkali compound and a solvent being selected from a group comprising water, methanol and ethanol. The preparation process of the above indicated polymer resin there is mixed separately the palladium salt and the complex-forming agent with two thirds of the solvent, the polymer with the remaining third of the solvent, whereupon both the solutions are mixed together and the alkali compound is added for adjusting pH value thereof. So prepared polymer resin is intended for metal coating printed circuits, electromagnetic sensors and decorative patterns.</description><edition>7</edition><language>cze ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000315&DB=EPODOC&CC=CZ&NR=286294B6$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000315&DB=EPODOC&CC=CZ&NR=286294B6$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOUMILLION JEAN-PHILIPPE</creatorcontrib><creatorcontrib>DELVAUX MARY-HLENE</creatorcontrib><creatorcontrib>DUFUUR PASCALE</creatorcontrib><creatorcontrib>SENDROWICZ HENRI</creatorcontrib><creatorcontrib>DUPUIS OLIVIER</creatorcontrib><creatorcontrib>MALNERO FERNANDEZ MARIE-CARMEN</creatorcontrib><title>Polymer resin with adjustable viscosity and pH value for application of catalytic palladium to substrate, process of its preparation and its use</title><description>Polymerní pryskyřice obsahuje palladnatou sůl, karboxylové kyseliny nebo chlorid jako komplexotvorné činidlo, ve vodě rozpustný polymer obsahující hydroxylové nebo karboxylové skupiny, alkalickou sloučeninu a rozpouštědlo vybrané ze skupiny voda, methanol a ethanol. Při její přípravě se odděleně mísí palladnatá sůl a komplexotvorné činidlo se dvěma třetinami rozpouštědla, polymer se zbývající třetinou rozpouštědla, načež se oba roztoky smísí a přidá se alkalická sloučenina pro úpravu pH. Polymerní pryskyřice je určena pro pokovování tištěných obvodů, elektromagnetických senzorů a dekorativních vzorů.ŕ
In the present invention there is disclosed a polymer resin containing a palladium salt, carboxylic acids or a chloride as a complex-forming agent, further water-soluble polymer containing hydroxyl or carboxyl groups, an alkali compound and a solvent being selected from a group comprising water, methanol and ethanol. The preparation process of the above indicated polymer resin there is mixed separately the palladium salt and the complex-forming agent with two thirds of the solvent, the polymer with the remaining third of the solvent, whereupon both the solutions are mixed together and the alkali compound is added for adjusting pH value thereof. So prepared polymer resin is intended for metal coating printed circuits, electromagnetic sensors and decorative patterns.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjD0OgkAQhWksjHoG5wDaoCHaSjSUFlY2ZFiGOGZhNzuzGG7hkYVob_V-8r03T95XZ4eWAgQS7uDF-gCsn1EUK0vQsxgnrANgV4MvoEcbCRoXAL23bFDZdeAaGB3aQdmAR2ux5tiCOpBYiQZU2oAPzpDIBLPKGMlj-O6n86mLQstk1qAVWv10kawv51tebMm7ksSjoY60zO_pIUuP-1O2-098AKFmTvw</recordid><startdate>20000315</startdate><enddate>20000315</enddate><creator>SOUMILLION JEAN-PHILIPPE</creator><creator>DELVAUX MARY-HLENE</creator><creator>DUFUUR PASCALE</creator><creator>SENDROWICZ HENRI</creator><creator>DUPUIS OLIVIER</creator><creator>MALNERO FERNANDEZ MARIE-CARMEN</creator><scope>EVB</scope></search><sort><creationdate>20000315</creationdate><title>Polymer resin with adjustable viscosity and pH value for application of catalytic palladium to substrate, process of its preparation and its use</title><author>SOUMILLION JEAN-PHILIPPE ; DELVAUX MARY-HLENE ; DUFUUR PASCALE ; SENDROWICZ HENRI ; DUPUIS OLIVIER ; MALNERO FERNANDEZ MARIE-CARMEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CZ286294B63</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>cze ; eng</language><creationdate>2000</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SOUMILLION JEAN-PHILIPPE</creatorcontrib><creatorcontrib>DELVAUX MARY-HLENE</creatorcontrib><creatorcontrib>DUFUUR PASCALE</creatorcontrib><creatorcontrib>SENDROWICZ HENRI</creatorcontrib><creatorcontrib>DUPUIS OLIVIER</creatorcontrib><creatorcontrib>MALNERO FERNANDEZ MARIE-CARMEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOUMILLION JEAN-PHILIPPE</au><au>DELVAUX MARY-HLENE</au><au>DUFUUR PASCALE</au><au>SENDROWICZ HENRI</au><au>DUPUIS OLIVIER</au><au>MALNERO FERNANDEZ MARIE-CARMEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polymer resin with adjustable viscosity and pH value for application of catalytic palladium to substrate, process of its preparation and its use</title><date>2000-03-15</date><risdate>2000</risdate><abstract>Polymerní pryskyřice obsahuje palladnatou sůl, karboxylové kyseliny nebo chlorid jako komplexotvorné činidlo, ve vodě rozpustný polymer obsahující hydroxylové nebo karboxylové skupiny, alkalickou sloučeninu a rozpouštědlo vybrané ze skupiny voda, methanol a ethanol. Při její přípravě se odděleně mísí palladnatá sůl a komplexotvorné činidlo se dvěma třetinami rozpouštědla, polymer se zbývající třetinou rozpouštědla, načež se oba roztoky smísí a přidá se alkalická sloučenina pro úpravu pH. Polymerní pryskyřice je určena pro pokovování tištěných obvodů, elektromagnetických senzorů a dekorativních vzorů.ŕ
In the present invention there is disclosed a polymer resin containing a palladium salt, carboxylic acids or a chloride as a complex-forming agent, further water-soluble polymer containing hydroxyl or carboxyl groups, an alkali compound and a solvent being selected from a group comprising water, methanol and ethanol. The preparation process of the above indicated polymer resin there is mixed separately the palladium salt and the complex-forming agent with two thirds of the solvent, the polymer with the remaining third of the solvent, whereupon both the solutions are mixed together and the alkali compound is added for adjusting pH value thereof. So prepared polymer resin is intended for metal coating printed circuits, electromagnetic sensors and decorative patterns.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Polymer resin with adjustable viscosity and pH value for application of catalytic palladium to substrate, process of its preparation and its use |
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