ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF
A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a sec...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LANTING MARK LORING GOESCHEL FREDERICK GERALD MCCONNELL ARDEN MARCUS |
| description | A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CZ108093A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CZ108093A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CZ108093A33</originalsourceid><addsrcrecordid>eNrjZIh2DA529XXyiVQIjgwOcfVV8HdTcFTwcHUMUXD29_FxdQ7xD1JwA2JHBaA6T2d_P5dQsJiLa5ins6uCo5-LAtyIgCB_Z9fgYIUQD9cgV383HgbWtMSc4lReKM3NIO_mGuLsoZtakB-fWlyQmJyal1oS7xxlaGBhYGnsaGxMWAUAqBkxIA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF</title><source>esp@cenet</source><creator>LANTING MARK LORING ; GOESCHEL FREDERICK GERALD ; MCCONNELL ARDEN MARCUS</creator><creatorcontrib>LANTING MARK LORING ; GOESCHEL FREDERICK GERALD ; MCCONNELL ARDEN MARCUS</creatorcontrib><description>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940216&DB=EPODOC&CC=CZ&NR=108093A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940216&DB=EPODOC&CC=CZ&NR=108093A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LANTING MARK LORING</creatorcontrib><creatorcontrib>GOESCHEL FREDERICK GERALD</creatorcontrib><creatorcontrib>MCCONNELL ARDEN MARCUS</creatorcontrib><title>ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF</title><description>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh2DA529XXyiVQIjgwOcfVV8HdTcFTwcHUMUXD29_FxdQ7xD1JwA2JHBaA6T2d_P5dQsJiLa5ins6uCo5-LAtyIgCB_Z9fgYIUQD9cgV383HgbWtMSc4lReKM3NIO_mGuLsoZtakB-fWlyQmJyal1oS7xxlaGBhYGnsaGxMWAUAqBkxIA</recordid><startdate>19940216</startdate><enddate>19940216</enddate><creator>LANTING MARK LORING</creator><creator>GOESCHEL FREDERICK GERALD</creator><creator>MCCONNELL ARDEN MARCUS</creator><scope>EVB</scope></search><sort><creationdate>19940216</creationdate><title>ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF</title><author>LANTING MARK LORING ; GOESCHEL FREDERICK GERALD ; MCCONNELL ARDEN MARCUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CZ108093A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LANTING MARK LORING</creatorcontrib><creatorcontrib>GOESCHEL FREDERICK GERALD</creatorcontrib><creatorcontrib>MCCONNELL ARDEN MARCUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LANTING MARK LORING</au><au>GOESCHEL FREDERICK GERALD</au><au>MCCONNELL ARDEN MARCUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF</title><date>1994-02-16</date><risdate>1994</risdate><abstract>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_CZ108093A3 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | ASSEMBLY SYSTEM OF A HEAT COLLECTOR FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY PROCESS THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T05%3A29%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LANTING%20MARK%20LORING&rft.date=1994-02-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECZ108093A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |