PRINTED WIRE-BOUND CIRCUIT BOARD AND METHOD OF ITS PRODUCTION

The solution can be generally used in the construction of electronic devices. It is one of the possible alternatives of the fixation and interconnection of electronic components and parts on the level of the plates. The technology of wire planar connections is based on the co-ordinately controlled pattern building of signal-controlled connections from the isolated wire conductor on the semi-product of the target plate. During this procedure, the required quality of adhesion of the fixation layer to the support plate is hard to attain; however, the user parameters and the reliability of the target plates with the wire planar connections depend on this quality. These disadvantages are removed by the plate being made in such a way that the distance interlayer is applied on the support plate by rolling up the heat sealing foil, by means of lamination rollers, which are heated up to a temperature of 70 to 130 degrees C, at the applied down pressure of 3 to 100 N per 10 mm of the rolled up width and with the rolling up speed of 0.1 to 4 meters per minute. A separation foil is removed from the semi-product surface of the plate between the repeated rolling up of the heat sealing foil and before the rolling up of the fixation layer. The goal of the solution is to attain the precisely defined spatial arrangement of the patterns of the signal-controlled connections in the volume of the built-up layered dielectric medium of the plate and to achieve the easy variability of such an arrangement.