Integrated circuit package structure
An integrated circuit package structure applied in the ball grid array package. The integrated circuit package structure comprises a circuit board, a base plate, a plurality of solder balls and a plurality of mats; wherein solder balls are arranged under the base plate to connect the base plate and...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An integrated circuit package structure applied in the ball grid array package. The integrated circuit package structure comprises a circuit board, a base plate, a plurality of solder balls and a plurality of mats; wherein solder balls are arranged under the base plate to connect the base plate and the printed circuit board. Mats are arranged under edge of the base plate to support the base plate on the circuit board. When solder balls are melted and deform due to heating of the reflow solder and weight of the base plate, the mat supports the base plate to remain in horizontality. |
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