Radiation base module set
The utility model relates to a heat radiation base seat module and is provided with a base seat, wherein the base seat is provided with a metal heat radiation fin group. A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implant...
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creator | PEIZHI YAO |
description | The utility model relates to a heat radiation base seat module and is provided with a base seat, wherein the base seat is provided with a metal heat radiation fin group. A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implantation component with the high-heat conduction characteristic vertical to the flat surface bottom plate layer assembly is nested in the flat surface bottom plate layer assembly. The implantation component can be made of heat conduction graphite composite material, metal heat conduction composite material without directivity or composite heat conduction material generating the phase change because of the heat, and the periphery of the bottom plate layer assembly is sheathed with a heat conduction frame with the non-directivity high-heat conduction characteristic. When the heat radiation base seat module is used, the implantation component is applied to the position of the heat source and is caused to rapidly absorb and conduct the heat generated by the heat source. Because a graphite layer has the specific directivity in the process of conducting the heat, the heat is immediately delivered toward the periphery to the heat conduction frame through the horizontal graphite layer when the heat conduction enters into the implantation component. Then the heat is rapidly diffused to the outside world by heat radiation fins. |
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A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implantation component with the high-heat conduction characteristic vertical to the flat surface bottom plate layer assembly is nested in the flat surface bottom plate layer assembly. The implantation component can be made of heat conduction graphite composite material, metal heat conduction composite material without directivity or composite heat conduction material generating the phase change because of the heat, and the periphery of the bottom plate layer assembly is sheathed with a heat conduction frame with the non-directivity high-heat conduction characteristic. When the heat radiation base seat module is used, the implantation component is applied to the position of the heat source and is caused to rapidly absorb and conduct the heat generated by the heat source. Because a graphite layer has the specific directivity in the process of conducting the heat, the heat is immediately delivered toward the periphery to the heat conduction frame through the horizontal graphite layer when the heat conduction enters into the implantation component. Then the heat is rapidly diffused to the outside world by heat radiation fins.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSTRUMENT DETAILS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061018&DB=EPODOC&CC=CN&NR=2829318Y$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061018&DB=EPODOC&CC=CN&NR=2829318Y$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PEIZHI YAO</creatorcontrib><title>Radiation base module set</title><description>The utility model relates to a heat radiation base seat module and is provided with a base seat, wherein the base seat is provided with a metal heat radiation fin group. A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implantation component with the high-heat conduction characteristic vertical to the flat surface bottom plate layer assembly is nested in the flat surface bottom plate layer assembly. The implantation component can be made of heat conduction graphite composite material, metal heat conduction composite material without directivity or composite heat conduction material generating the phase change because of the heat, and the periphery of the bottom plate layer assembly is sheathed with a heat conduction frame with the non-directivity high-heat conduction characteristic. When the heat radiation base seat module is used, the implantation component is applied to the position of the heat source and is caused to rapidly absorb and conduct the heat generated by the heat source. Because a graphite layer has the specific directivity in the process of conducting the heat, the heat is immediately delivered toward the periphery to the heat conduction frame through the horizontal graphite layer when the heat conduction enters into the implantation component. Then the heat is rapidly diffused to the outside world by heat radiation fins.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSTRUMENT DETAILS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAMSkzJTCzJzM9TSEosTlXIzU8pzUlVKE4t4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8c5-RhZGlsaGFpGRxkQoAQDSOSKK</recordid><startdate>20061018</startdate><enddate>20061018</enddate><creator>PEIZHI YAO</creator><scope>EVB</scope></search><sort><creationdate>20061018</creationdate><title>Radiation base module set</title><author>PEIZHI YAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN2829318YY3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSTRUMENT DETAILS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PEIZHI YAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PEIZHI YAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radiation base module set</title><date>2006-10-18</date><risdate>2006</risdate><abstract>The utility model relates to a heat radiation base seat module and is provided with a base seat, wherein the base seat is provided with a metal heat radiation fin group. A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implantation component with the high-heat conduction characteristic vertical to the flat surface bottom plate layer assembly is nested in the flat surface bottom plate layer assembly. The implantation component can be made of heat conduction graphite composite material, metal heat conduction composite material without directivity or composite heat conduction material generating the phase change because of the heat, and the periphery of the bottom plate layer assembly is sheathed with a heat conduction frame with the non-directivity high-heat conduction characteristic. When the heat radiation base seat module is used, the implantation component is applied to the position of the heat source and is caused to rapidly absorb and conduct the heat generated by the heat source. Because a graphite layer has the specific directivity in the process of conducting the heat, the heat is immediately delivered toward the periphery to the heat conduction frame through the horizontal graphite layer when the heat conduction enters into the implantation component. Then the heat is rapidly diffused to the outside world by heat radiation fins.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Radiation base module set |
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