Chip constructional structure

Chip constructional structure

A chip packaging structure mainly comprises a carrier, at least a chip, a plurality of welding wires and a protective, wherein the carrier is equipped with a top side, a floor and a passage communicating the top side and the floor, the chip is positioned on the carrier and pushes against one end of...

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1. Verfasser: CHENGJIAO WU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHENGJIAO WU
description A chip packaging structure mainly comprises a carrier, at least a chip, a plurality of welding wires and a protective, wherein the carrier is equipped with a top side, a floor and a passage communicating the top side and the floor, the chip is positioned on the carrier and pushes against one end of the passage, one end of each welding wire is connected to the chip disposed at the end of the passage, and the other end of the welding wire is connected to the carrier disposed at the other end of the passage by an approximately horizontal method, and the protective pushes against one end of the passage, enabling the welding wire positioned at the other end of the passage to be covered by the protective, without being damaged by external forces. Further, the best height from the bottom of the protective to the carrier is 0.4 millimeters.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip constructional structure
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