Radiator for central processor
The utility model relates to a heat radiating device for a central processor, mainly composed of a base for a heat radiating mechanism, a heat pipe, a heat radiating mechanism and a fan; the base for a heat radiating mechanism is used for fixing a fastener. Heat radiating fins are arranged on both s...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | SHUREN YU |
description | The utility model relates to a heat radiating device for a central processor, mainly composed of a base for a heat radiating mechanism, a heat pipe, a heat radiating mechanism and a fan; the base for a heat radiating mechanism is used for fixing a fastener. Heat radiating fins are arranged on both sides of the base for a heat radiating mechanism; at least one heat pipe is arranged at the central part of the base for a heat radiating mechanism. The heat pipe is sheathed into a through hole at the central part of the base for a heat radiating mechanism to achieve the state of complete and close combination in the mode of stamping. The other end of the heat pipe is tightly sheathed with the heat radiating mechanism with strengthened heat radiating effect. The heat radiating mechanism is arranged at the ventilation point of a computer casing; moreover, the fan is screwed onto the surface of the heat radiating mechanism to force the mode of heat dissipation to rapidly and effectively reduce the high temperature produced by a central processor. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN2342407YY</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN2342407YY</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN2342407YY3</originalsourceid><addsrcrecordid>eNrjZJALSkzJTCzJL1JIA-Lk1LySosQchYKi_OTU4uL8Ih4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckAjUkVoS7-xnZGxiZGJgHhlpTIQSAMn2JLc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Radiator for central processor</title><source>esp@cenet</source><creator>SHUREN YU</creator><creatorcontrib>SHUREN YU</creatorcontrib><description>The utility model relates to a heat radiating device for a central processor, mainly composed of a base for a heat radiating mechanism, a heat pipe, a heat radiating mechanism and a fan; the base for a heat radiating mechanism is used for fixing a fastener. Heat radiating fins are arranged on both sides of the base for a heat radiating mechanism; at least one heat pipe is arranged at the central part of the base for a heat radiating mechanism. The heat pipe is sheathed into a through hole at the central part of the base for a heat radiating mechanism to achieve the state of complete and close combination in the mode of stamping. The other end of the heat pipe is tightly sheathed with the heat radiating mechanism with strengthened heat radiating effect. The heat radiating mechanism is arranged at the ventilation point of a computer casing; moreover, the fan is screwed onto the surface of the heat radiating mechanism to force the mode of heat dissipation to rapidly and effectively reduce the high temperature produced by a central processor.</description><edition>6</edition><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19991006&DB=EPODOC&CC=CN&NR=2342407Y$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19991006&DB=EPODOC&CC=CN&NR=2342407Y$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHUREN YU</creatorcontrib><title>Radiator for central processor</title><description>The utility model relates to a heat radiating device for a central processor, mainly composed of a base for a heat radiating mechanism, a heat pipe, a heat radiating mechanism and a fan; the base for a heat radiating mechanism is used for fixing a fastener. Heat radiating fins are arranged on both sides of the base for a heat radiating mechanism; at least one heat pipe is arranged at the central part of the base for a heat radiating mechanism. The heat pipe is sheathed into a through hole at the central part of the base for a heat radiating mechanism to achieve the state of complete and close combination in the mode of stamping. The other end of the heat pipe is tightly sheathed with the heat radiating mechanism with strengthened heat radiating effect. The heat radiating mechanism is arranged at the ventilation point of a computer casing; moreover, the fan is screwed onto the surface of the heat radiating mechanism to force the mode of heat dissipation to rapidly and effectively reduce the high temperature produced by a central processor.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALSkzJTCzJL1JIA-Lk1LySosQchYKi_OTU4uL8Ih4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckAjUkVoS7-xnZGxiZGJgHhlpTIQSAMn2JLc</recordid><startdate>19991006</startdate><enddate>19991006</enddate><creator>SHUREN YU</creator><scope>EVB</scope></search><sort><creationdate>19991006</creationdate><title>Radiator for central processor</title><author>SHUREN YU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN2342407YY3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHUREN YU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHUREN YU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radiator for central processor</title><date>1999-10-06</date><risdate>1999</risdate><abstract>The utility model relates to a heat radiating device for a central processor, mainly composed of a base for a heat radiating mechanism, a heat pipe, a heat radiating mechanism and a fan; the base for a heat radiating mechanism is used for fixing a fastener. Heat radiating fins are arranged on both sides of the base for a heat radiating mechanism; at least one heat pipe is arranged at the central part of the base for a heat radiating mechanism. The heat pipe is sheathed into a through hole at the central part of the base for a heat radiating mechanism to achieve the state of complete and close combination in the mode of stamping. The other end of the heat pipe is tightly sheathed with the heat radiating mechanism with strengthened heat radiating effect. The heat radiating mechanism is arranged at the ventilation point of a computer casing; moreover, the fan is screwed onto the surface of the heat radiating mechanism to force the mode of heat dissipation to rapidly and effectively reduce the high temperature produced by a central processor.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_CN2342407YY |
source | esp@cenet |
subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
title | Radiator for central processor |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T23%3A27%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHUREN%20YU&rft.date=1999-10-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN2342407YY%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |