Suction jig for chip cover

Suction jig for chip cover

The utility model discloses a suction jig for a chip cover, relates to the technical field of chip packaging, and aims to solve the technical problem that the chip cover and a to-be-packaged chip are not tightly attached due to non-uniform acting force on the chip cover when the chip is manually att...

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Hauptverfasser: HU SHUYI, JIANG HUAJUN, GUO FEI, LIU CHANGHUA
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HU SHUYI
JIANG HUAJUN
GUO FEI
LIU CHANGHUA
description The utility model discloses a suction jig for a chip cover, relates to the technical field of chip packaging, and aims to solve the technical problem that the chip cover and a to-be-packaged chip are not tightly attached due to non-uniform acting force on the chip cover when the chip is manually attached in the prior art. The suction jig of the chip cover comprises a suction nozzle and a suction nozzle support, the suction nozzle is provided with one or more suction holes, and the outline of the suction nozzle is matched with the to-be-sucked face of the chip cover; the suction nozzle support is provided with a first channel and a mounting groove, the suction nozzle is arranged in the mounting groove, the first channel is communicated with the mounting groove, the first channel is communicated with the adsorption hole, and the first channel is used for being communicated with an external negative pressure device. The suction jig of the chip cover provided by the utility model is used for mounting the chip cov
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221747195UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221747195UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221747195UU3</originalsourceid><addsrcrecordid>eNrjZJAKLk0uyczPU8jKTFdIyy9SSM7ILFBIzi9LLeJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhuYm5oaWpqGhxkQpAgB0_SOK</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Suction jig for chip cover</title><source>esp@cenet</source><creator>HU SHUYI ; JIANG HUAJUN ; GUO FEI ; LIU CHANGHUA</creator><creatorcontrib>HU SHUYI ; JIANG HUAJUN ; GUO FEI ; LIU CHANGHUA</creatorcontrib><description>The utility model discloses a suction jig for a chip cover, relates to the technical field of chip packaging, and aims to solve the technical problem that the chip cover and a to-be-packaged chip are not tightly attached due to non-uniform acting force on the chip cover when the chip is manually attached in the prior art. The suction jig of the chip cover comprises a suction nozzle and a suction nozzle support, the suction nozzle is provided with one or more suction holes, and the outline of the suction nozzle is matched with the to-be-sucked face of the chip cover; the suction nozzle support is provided with a first channel and a mounting groove, the suction nozzle is arranged in the mounting groove, the first channel is communicated with the mounting groove, the first channel is communicated with the adsorption hole, and the first channel is used for being communicated with an external negative pressure device. The suction jig of the chip cover provided by the utility model is used for mounting the chip cov</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240920&amp;DB=EPODOC&amp;CC=CN&amp;NR=221747195U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240920&amp;DB=EPODOC&amp;CC=CN&amp;NR=221747195U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU SHUYI</creatorcontrib><creatorcontrib>JIANG HUAJUN</creatorcontrib><creatorcontrib>GUO FEI</creatorcontrib><creatorcontrib>LIU CHANGHUA</creatorcontrib><title>Suction jig for chip cover</title><description>The utility model discloses a suction jig for a chip cover, relates to the technical field of chip packaging, and aims to solve the technical problem that the chip cover and a to-be-packaged chip are not tightly attached due to non-uniform acting force on the chip cover when the chip is manually attached in the prior art. The suction jig of the chip cover comprises a suction nozzle and a suction nozzle support, the suction nozzle is provided with one or more suction holes, and the outline of the suction nozzle is matched with the to-be-sucked face of the chip cover; the suction nozzle support is provided with a first channel and a mounting groove, the suction nozzle is arranged in the mounting groove, the first channel is communicated with the mounting groove, the first channel is communicated with the adsorption hole, and the first channel is used for being communicated with an external negative pressure device. The suction jig of the chip cover provided by the utility model is used for mounting the chip cov</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKLk0uyczPU8jKTFdIyy9SSM7ILFBIzi9LLeJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhuYm5oaWpqGhxkQpAgB0_SOK</recordid><startdate>20240920</startdate><enddate>20240920</enddate><creator>HU SHUYI</creator><creator>JIANG HUAJUN</creator><creator>GUO FEI</creator><creator>LIU CHANGHUA</creator><scope>EVB</scope></search><sort><creationdate>20240920</creationdate><title>Suction jig for chip cover</title><author>HU SHUYI ; JIANG HUAJUN ; GUO FEI ; LIU CHANGHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221747195UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HU SHUYI</creatorcontrib><creatorcontrib>JIANG HUAJUN</creatorcontrib><creatorcontrib>GUO FEI</creatorcontrib><creatorcontrib>LIU CHANGHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU SHUYI</au><au>JIANG HUAJUN</au><au>GUO FEI</au><au>LIU CHANGHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Suction jig for chip cover</title><date>2024-09-20</date><risdate>2024</risdate><abstract>The utility model discloses a suction jig for a chip cover, relates to the technical field of chip packaging, and aims to solve the technical problem that the chip cover and a to-be-packaged chip are not tightly attached due to non-uniform acting force on the chip cover when the chip is manually attached in the prior art. The suction jig of the chip cover comprises a suction nozzle and a suction nozzle support, the suction nozzle is provided with one or more suction holes, and the outline of the suction nozzle is matched with the to-be-sucked face of the chip cover; the suction nozzle support is provided with a first channel and a mounting groove, the suction nozzle is arranged in the mounting groove, the first channel is communicated with the mounting groove, the first channel is communicated with the adsorption hole, and the first channel is used for being communicated with an external negative pressure device. The suction jig of the chip cover provided by the utility model is used for mounting the chip cov</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Suction jig for chip cover
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