Ultraviolet LED chip packaging body
The utility model belongs to the technical field of LED (light-emitting diode) chip packaging, and particularly relates to an ultraviolet LED chip packaging body, which comprises a first layer of aluminum nitride flat substrate, a second layer of aluminum nitride flat substrate, a reflection cup uni...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model belongs to the technical field of LED (light-emitting diode) chip packaging, and particularly relates to an ultraviolet LED chip packaging body, which comprises a first layer of aluminum nitride flat substrate, a second layer of aluminum nitride flat substrate, a reflection cup unit, a high-reflection Teflon material and an ultraviolet light-emitting chip, the second layer of aluminum nitride flat substrate is welded at the center of the first layer of aluminum nitride flat substrate, and the ultraviolet light-emitting chip is welded at the center of the second layer of aluminum nitride flat substrate. A high-reflection Teflon material is arranged between the second-layer aluminum nitride flat substrate and the first-layer aluminum nitride flat substrate, the reflection cup unit is arranged on the first-layer aluminum nitride flat substrate, and the ultraviolet light-emitting chip is arranged on the second-layer aluminum nitride flat substrate. According to the utility model, the transverse |
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