Novel high-efficiency online production system

Novel high-efficiency online production system

The utility model discloses a novel high-efficiency online production system, which comprises a first automatic die bonder, a second automatic die bonder and a conveying mechanism erected between the first automatic die bonder and the second automatic die bonder, and the conveying mechanism comprise...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TU JIALI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TU JIALI
description The utility model discloses a novel high-efficiency online production system, which comprises a first automatic die bonder, a second automatic die bonder and a conveying mechanism erected between the first automatic die bonder and the second automatic die bonder, and the conveying mechanism comprises a conveying guide rail, a conveying motor and a sensor. The transmission motor drives the transmission guide rail to drive the lead frame to move from the outlet of the first automatic die bonder to the inlet of the second automatic die bonder, and the grabbing mechanism of the second automatic die bonder is used for grabbing the lead frame to feed the lead frame into the second automatic die bonder to start die bonding. The lead frame with the chip can be smoothly transited to the second automatic die bonder, so that after the first die bonding operation is completed, the lead frame can directly enter the second automatic die bonder to complete the second die bonding operation, the risk caused by transporting th
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221596384UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221596384UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221596384UU3</originalsourceid><addsrcrecordid>eNrjZNDzyy9LzVHIyEzP0E1NS8tMzkzNS65UyM_LycxLVSgoyk8pTS7JzM9TKK4sLknN5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkaGppZmxhYmoaHGRCkCAHs-K9A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Novel high-efficiency online production system</title><source>esp@cenet</source><creator>TU JIALI</creator><creatorcontrib>TU JIALI</creatorcontrib><description>The utility model discloses a novel high-efficiency online production system, which comprises a first automatic die bonder, a second automatic die bonder and a conveying mechanism erected between the first automatic die bonder and the second automatic die bonder, and the conveying mechanism comprises a conveying guide rail, a conveying motor and a sensor. The transmission motor drives the transmission guide rail to drive the lead frame to move from the outlet of the first automatic die bonder to the inlet of the second automatic die bonder, and the grabbing mechanism of the second automatic die bonder is used for grabbing the lead frame to feed the lead frame into the second automatic die bonder to start die bonding. The lead frame with the chip can be smoothly transited to the second automatic die bonder, so that after the first die bonding operation is completed, the lead frame can directly enter the second automatic die bonder to complete the second die bonding operation, the risk caused by transporting th</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240823&amp;DB=EPODOC&amp;CC=CN&amp;NR=221596384U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240823&amp;DB=EPODOC&amp;CC=CN&amp;NR=221596384U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TU JIALI</creatorcontrib><title>Novel high-efficiency online production system</title><description>The utility model discloses a novel high-efficiency online production system, which comprises a first automatic die bonder, a second automatic die bonder and a conveying mechanism erected between the first automatic die bonder and the second automatic die bonder, and the conveying mechanism comprises a conveying guide rail, a conveying motor and a sensor. The transmission motor drives the transmission guide rail to drive the lead frame to move from the outlet of the first automatic die bonder to the inlet of the second automatic die bonder, and the grabbing mechanism of the second automatic die bonder is used for grabbing the lead frame to feed the lead frame into the second automatic die bonder to start die bonding. The lead frame with the chip can be smoothly transited to the second automatic die bonder, so that after the first die bonding operation is completed, the lead frame can directly enter the second automatic die bonder to complete the second die bonding operation, the risk caused by transporting th</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDzyy9LzVHIyEzP0E1NS8tMzkzNS65UyM_LycxLVSgoyk8pTS7JzM9TKK4sLknN5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkaGppZmxhYmoaHGRCkCAHs-K9A</recordid><startdate>20240823</startdate><enddate>20240823</enddate><creator>TU JIALI</creator><scope>EVB</scope></search><sort><creationdate>20240823</creationdate><title>Novel high-efficiency online production system</title><author>TU JIALI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221596384UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TU JIALI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TU JIALI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Novel high-efficiency online production system</title><date>2024-08-23</date><risdate>2024</risdate><abstract>The utility model discloses a novel high-efficiency online production system, which comprises a first automatic die bonder, a second automatic die bonder and a conveying mechanism erected between the first automatic die bonder and the second automatic die bonder, and the conveying mechanism comprises a conveying guide rail, a conveying motor and a sensor. The transmission motor drives the transmission guide rail to drive the lead frame to move from the outlet of the first automatic die bonder to the inlet of the second automatic die bonder, and the grabbing mechanism of the second automatic die bonder is used for grabbing the lead frame to feed the lead frame into the second automatic die bonder to start die bonding. The lead frame with the chip can be smoothly transited to the second automatic die bonder, so that after the first die bonding operation is completed, the lead frame can directly enter the second automatic die bonder to complete the second die bonding operation, the risk caused by transporting th</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN221596384UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Novel high-efficiency online production system
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T17%3A01%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TU%20JIALI&rft.date=2024-08-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN221596384UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true