Glue pouring power supply

Glue pouring power supply

The utility model provides a glue pouring power supply, which comprises a shell and a circuit board arranged in the shell, the shell is filled with pouring sealant, the shell is provided with a wire inlet hole, a wire outlet hole, a glue pouring hole and an overflow hole, the inner side of a bottom...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LI HUAJUAN, LI SUFENG, SU FEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LI HUAJUAN
LI SUFENG
SU FEI
description The utility model provides a glue pouring power supply, which comprises a shell and a circuit board arranged in the shell, the shell is filled with pouring sealant, the shell is provided with a wire inlet hole, a wire outlet hole, a glue pouring hole and an overflow hole, the inner side of a bottom plate of the shell is provided with a group of first convex columns with screw holes, and the circuit board is fixed on the first convex columns through screws; the first convex column is sleeved with a heat dissipation block, the heat dissipation block comprises a heat absorption plate located at the top and a heat dissipation plate located at the bottom, the heat absorption plate and the heat dissipation plate are integrally connected through a heat conduction column, a sleeve hole is formed in the heat dissipation block, and the sleeve hole sequentially penetrates through the heat absorption plate, the heat conduction column and the heat dissipation plate; and when the heat dissipation block sleeves the peripher
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221575889UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221575889UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221575889UU3</originalsourceid><addsrcrecordid>eNrjZJB0zylNVSjILy3KzEsH0uWpRQrFpQUFOZU8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_IyNDU3NTCwjI01JgoRQB7tiO9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Glue pouring power supply</title><source>esp@cenet</source><creator>LI HUAJUAN ; LI SUFENG ; SU FEI</creator><creatorcontrib>LI HUAJUAN ; LI SUFENG ; SU FEI</creatorcontrib><description>The utility model provides a glue pouring power supply, which comprises a shell and a circuit board arranged in the shell, the shell is filled with pouring sealant, the shell is provided with a wire inlet hole, a wire outlet hole, a glue pouring hole and an overflow hole, the inner side of a bottom plate of the shell is provided with a group of first convex columns with screw holes, and the circuit board is fixed on the first convex columns through screws; the first convex column is sleeved with a heat dissipation block, the heat dissipation block comprises a heat absorption plate located at the top and a heat dissipation plate located at the bottom, the heat absorption plate and the heat dissipation plate are integrally connected through a heat conduction column, a sleeve hole is formed in the heat dissipation block, and the sleeve hole sequentially penetrates through the heat absorption plate, the heat conduction column and the heat dissipation plate; and when the heat dissipation block sleeves the peripher</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=CN&amp;NR=221575889U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=CN&amp;NR=221575889U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI HUAJUAN</creatorcontrib><creatorcontrib>LI SUFENG</creatorcontrib><creatorcontrib>SU FEI</creatorcontrib><title>Glue pouring power supply</title><description>The utility model provides a glue pouring power supply, which comprises a shell and a circuit board arranged in the shell, the shell is filled with pouring sealant, the shell is provided with a wire inlet hole, a wire outlet hole, a glue pouring hole and an overflow hole, the inner side of a bottom plate of the shell is provided with a group of first convex columns with screw holes, and the circuit board is fixed on the first convex columns through screws; the first convex column is sleeved with a heat dissipation block, the heat dissipation block comprises a heat absorption plate located at the top and a heat dissipation plate located at the bottom, the heat absorption plate and the heat dissipation plate are integrally connected through a heat conduction column, a sleeve hole is formed in the heat dissipation block, and the sleeve hole sequentially penetrates through the heat absorption plate, the heat conduction column and the heat dissipation plate; and when the heat dissipation block sleeves the peripher</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB0zylNVSjILy3KzEsH0uWpRQrFpQUFOZU8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_IyNDU3NTCwjI01JgoRQB7tiO9</recordid><startdate>20240820</startdate><enddate>20240820</enddate><creator>LI HUAJUAN</creator><creator>LI SUFENG</creator><creator>SU FEI</creator><scope>EVB</scope></search><sort><creationdate>20240820</creationdate><title>Glue pouring power supply</title><author>LI HUAJUAN ; LI SUFENG ; SU FEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221575889UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI HUAJUAN</creatorcontrib><creatorcontrib>LI SUFENG</creatorcontrib><creatorcontrib>SU FEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI HUAJUAN</au><au>LI SUFENG</au><au>SU FEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Glue pouring power supply</title><date>2024-08-20</date><risdate>2024</risdate><abstract>The utility model provides a glue pouring power supply, which comprises a shell and a circuit board arranged in the shell, the shell is filled with pouring sealant, the shell is provided with a wire inlet hole, a wire outlet hole, a glue pouring hole and an overflow hole, the inner side of a bottom plate of the shell is provided with a group of first convex columns with screw holes, and the circuit board is fixed on the first convex columns through screws; the first convex column is sleeved with a heat dissipation block, the heat dissipation block comprises a heat absorption plate located at the top and a heat dissipation plate located at the bottom, the heat absorption plate and the heat dissipation plate are integrally connected through a heat conduction column, a sleeve hole is formed in the heat dissipation block, and the sleeve hole sequentially penetrates through the heat absorption plate, the heat conduction column and the heat dissipation plate; and when the heat dissipation block sleeves the peripher</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN221575889UU
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Glue pouring power supply
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T14%3A36%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20HUAJUAN&rft.date=2024-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN221575889UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true