Temperature control device for PCB substrate
The utility model relates to the technical field of substrate temperature control, in particular to a temperature control device for a PCB (Printed Circuit Board) substrate, which comprises a metal box, fan blades and a heating resistor, through holes are formed in the metal box, the fan blades are...
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| creator | DAI CHENGTAO ZHANG YAN ZHANG JIAN ZENG FANDONG YU HUI ZHANG JIYONG WANG YIHUI |
| description | The utility model relates to the technical field of substrate temperature control, in particular to a temperature control device for a PCB (Printed Circuit Board) substrate, which comprises a metal box, fan blades and a heating resistor, through holes are formed in the metal box, the fan blades are installed in the through holes, and one side of the metal box is connected with the PCB substrate; the heating resistor is electrically connected with the power supply and is in attached connection with the surface of the metal box, and a heat conducting assembly for uniformly transferring heat to the PCB substrate is arranged at the joint of the heating resistor and the metal box. The device not only can carry out cooling or heat dissipation on the PCB substrate according to the temperature required by work of the PCB substrate, but also is simple in structure, easy to implement and convenient to operate.
本实用新型涉及基板温控技术领域，尤其涉及一种PCB基板用的温控装置，包括：金属盒、扇叶和加热电阻；所述金属盒上设有通孔，且扇叶安装在通孔中，且金属盒的一侧与PCB基板连接；所述加热电阻与电源电连接，并与金属盒的表面贴合连 |
| format | Patent |
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本实用新型涉及基板温控技术领域，尤其涉及一种PCB基板用的温控装置，包括：金属盒、扇叶和加热电阻；所述金属盒上设有通孔，且扇叶安装在通孔中，且金属盒的一侧与PCB基板连接；所述加热电阻与电源电连接，并与金属盒的表面贴合连</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240813&DB=EPODOC&CC=CN&NR=221531746U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240813&DB=EPODOC&CC=CN&NR=221531746U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAI CHENGTAO</creatorcontrib><creatorcontrib>ZHANG YAN</creatorcontrib><creatorcontrib>ZHANG JIAN</creatorcontrib><creatorcontrib>ZENG FANDONG</creatorcontrib><creatorcontrib>YU HUI</creatorcontrib><creatorcontrib>ZHANG JIYONG</creatorcontrib><creatorcontrib>WANG YIHUI</creatorcontrib><title>Temperature control device for PCB substrate</title><description>The utility model relates to the technical field of substrate temperature control, in particular to a temperature control device for a PCB (Printed Circuit Board) substrate, which comprises a metal box, fan blades and a heating resistor, through holes are formed in the metal box, the fan blades are installed in the through holes, and one side of the metal box is connected with the PCB substrate; the heating resistor is electrically connected with the power supply and is in attached connection with the surface of the metal box, and a heat conducting assembly for uniformly transferring heat to the PCB substrate is arranged at the joint of the heating resistor and the metal box. The device not only can carry out cooling or heat dissipation on the PCB substrate according to the temperature required by work of the PCB substrate, but also is simple in structure, easy to implement and convenient to operate.
本实用新型涉及基板温控技术领域，尤其涉及一种PCB基板用的温控装置，包括：金属盒、扇叶和加热电阻；所述金属盒上设有通孔，且扇叶安装在通孔中，且金属盒的一侧与PCB基板连接；所述加热电阻与电源电连接，并与金属盒的表面贴合连</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJSc0tSC1KLCktSlVIzs8rKcrPUUhJLctMTlVIyy9SCHB2UiguTSouASpJ5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkaGpsaG5iZmoaHGRCkCAOh1Kn0</recordid><startdate>20240813</startdate><enddate>20240813</enddate><creator>DAI CHENGTAO</creator><creator>ZHANG YAN</creator><creator>ZHANG JIAN</creator><creator>ZENG FANDONG</creator><creator>YU HUI</creator><creator>ZHANG JIYONG</creator><creator>WANG YIHUI</creator><scope>EVB</scope></search><sort><creationdate>20240813</creationdate><title>Temperature control device for PCB substrate</title><author>DAI CHENGTAO ; ZHANG YAN ; ZHANG JIAN ; ZENG FANDONG ; YU HUI ; ZHANG JIYONG ; WANG YIHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221531746UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>DAI CHENGTAO</creatorcontrib><creatorcontrib>ZHANG YAN</creatorcontrib><creatorcontrib>ZHANG JIAN</creatorcontrib><creatorcontrib>ZENG FANDONG</creatorcontrib><creatorcontrib>YU HUI</creatorcontrib><creatorcontrib>ZHANG JIYONG</creatorcontrib><creatorcontrib>WANG YIHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAI CHENGTAO</au><au>ZHANG YAN</au><au>ZHANG JIAN</au><au>ZENG FANDONG</au><au>YU HUI</au><au>ZHANG JIYONG</au><au>WANG YIHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Temperature control device for PCB substrate</title><date>2024-08-13</date><risdate>2024</risdate><abstract>The utility model relates to the technical field of substrate temperature control, in particular to a temperature control device for a PCB (Printed Circuit Board) substrate, which comprises a metal box, fan blades and a heating resistor, through holes are formed in the metal box, the fan blades are installed in the through holes, and one side of the metal box is connected with the PCB substrate; the heating resistor is electrically connected with the power supply and is in attached connection with the surface of the metal box, and a heat conducting assembly for uniformly transferring heat to the PCB substrate is arranged at the joint of the heating resistor and the metal box. The device not only can carry out cooling or heat dissipation on the PCB substrate according to the temperature required by work of the PCB substrate, but also is simple in structure, easy to implement and convenient to operate.
本实用新型涉及基板温控技术领域，尤其涉及一种PCB基板用的温控装置，包括：金属盒、扇叶和加热电阻；所述金属盒上设有通孔，且扇叶安装在通孔中，且金属盒的一侧与PCB基板连接；所述加热电阻与电源电连接，并与金属盒的表面贴合连</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Temperature control device for PCB substrate |
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