PCM shunt heat dissipation structure, battery protection board and battery
The utility model relates to the technical field of batteries, in particular to a PCM shunt heat dissipation structure, a battery protection plate and a battery. The PCM shunt heat dissipation structure comprises a PCB, an MOS tube and metal via holes, at least one pin of the MOS tube is welded to t...
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creator | LIU GUOFU LI BAOJIA LIU SHIZHEN LYU PINFENG WU JIACHAO |
description | The utility model relates to the technical field of batteries, in particular to a PCM shunt heat dissipation structure, a battery protection plate and a battery. The PCM shunt heat dissipation structure comprises a PCB, an MOS tube and metal via holes, at least one pin of the MOS tube is welded to the PCB through a through-flow bonding pad, and the through-flow bonding pad is electrically connected with at least two circuit layers of the PCB through the metal via holes. Therefore, the current flowing through the MOS tube can be directly shunted to each circuit layer of the PCB through the metal via holes at the pins, so that the internal resistance of a current path can be effectively reduced, and the internal resistance of the PCM and the battery protection board can be effectively reduced; and meanwhile, the metal via hole is directly arranged below the through-flow bonding pad, so that heat generated when the MOS tube is electrified can be timely conducted and dissipated through the metal via hole, and the |
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Therefore, the current flowing through the MOS tube can be directly shunted to each circuit layer of the PCB through the metal via holes at the pins, so that the internal resistance of a current path can be effectively reduced, and the internal resistance of the PCM and the battery protection board can be effectively reduced; and meanwhile, the metal via hole is directly arranged below the through-flow bonding pad, so that heat generated when the MOS tube is electrified can be timely conducted and dissipated through the metal via hole, and the</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240809&DB=EPODOC&CC=CN&NR=221509859U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240809&DB=EPODOC&CC=CN&NR=221509859U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU GUOFU</creatorcontrib><creatorcontrib>LI BAOJIA</creatorcontrib><creatorcontrib>LIU SHIZHEN</creatorcontrib><creatorcontrib>LYU PINFENG</creatorcontrib><creatorcontrib>WU JIACHAO</creatorcontrib><title>PCM shunt heat dissipation structure, battery protection board and battery</title><description>The utility model relates to the technical field of batteries, in particular to a PCM shunt heat dissipation structure, a battery protection plate and a battery. 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The PCM shunt heat dissipation structure comprises a PCB, an MOS tube and metal via holes, at least one pin of the MOS tube is welded to the PCB through a through-flow bonding pad, and the through-flow bonding pad is electrically connected with at least two circuit layers of the PCB through the metal via holes. Therefore, the current flowing through the MOS tube can be directly shunted to each circuit layer of the PCB through the metal via holes at the pins, so that the internal resistance of a current path can be effectively reduced, and the internal resistance of the PCM and the battery protection board can be effectively reduced; and meanwhile, the metal via hole is directly arranged below the through-flow bonding pad, so that heat generated when the MOS tube is electrified can be timely conducted and dissipated through the metal via hole, and the</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY |
title | PCM shunt heat dissipation structure, battery protection board and battery |
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