Wafer drying device based on Fab

The wafer drying device based on the Fab comprises a device body, the device body comprises a base, a storage box and a control box, the storage box is installed on the top of the base, and the control box is installed on the top of the storage box; the storage box is of a rectangular structure, the...

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Hauptverfasser: LIU CHUQUN, PAN JINGBO
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creator LIU CHUQUN
PAN JINGBO
description The wafer drying device based on the Fab comprises a device body, the device body comprises a base, a storage box and a control box, the storage box is installed on the top of the base, and the control box is installed on the top of the storage box; the storage box is of a rectangular structure, the interior of the storage box is of a hollow structure, a plurality of sets of mounting frames which are transversely distributed at equal intervals are arranged in the storage box, a plurality of sets of storage blocks which are distributed at equal intervals in rows are arranged on the left side and the right side of each mounting frame, and each storage block is of an L-shaped structure; a plurality of sets of position detection sensors are arranged in the storage box and located on the rear side of the storage block. According to the device, the wafers can be effectively stored in a sealed mode, the temperature and humidity in the storage environment can be controlled, and the stability of the wafer storage envi
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221484027UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221484027UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221484027UU3</originalsourceid><addsrcrecordid>eNrjZFAIT0xLLVJIKarMzEtXSEkty0xOVUhKLE5NUcjPU3BLTOJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhiYWJgZG5qGhxkQpAgBZpCVO</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer drying device based on Fab</title><source>esp@cenet</source><creator>LIU CHUQUN ; PAN JINGBO</creator><creatorcontrib>LIU CHUQUN ; PAN JINGBO</creatorcontrib><description>The wafer drying device based on the Fab comprises a device body, the device body comprises a base, a storage box and a control box, the storage box is installed on the top of the base, and the control box is installed on the top of the storage box; the storage box is of a rectangular structure, the interior of the storage box is of a hollow structure, a plurality of sets of mounting frames which are transversely distributed at equal intervals are arranged in the storage box, a plurality of sets of storage blocks which are distributed at equal intervals in rows are arranged on the left side and the right side of each mounting frame, and each storage block is of an L-shaped structure; a plurality of sets of position detection sensors are arranged in the storage box and located on the rear side of the storage block. According to the device, the wafers can be effectively stored in a sealed mode, the temperature and humidity in the storage environment can be controlled, and the stability of the wafer storage envi</description><language>chi ; eng</language><subject>BLASTING ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240806&amp;DB=EPODOC&amp;CC=CN&amp;NR=221484027U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240806&amp;DB=EPODOC&amp;CC=CN&amp;NR=221484027U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU CHUQUN</creatorcontrib><creatorcontrib>PAN JINGBO</creatorcontrib><title>Wafer drying device based on Fab</title><description>The wafer drying device based on the Fab comprises a device body, the device body comprises a base, a storage box and a control box, the storage box is installed on the top of the base, and the control box is installed on the top of the storage box; the storage box is of a rectangular structure, the interior of the storage box is of a hollow structure, a plurality of sets of mounting frames which are transversely distributed at equal intervals are arranged in the storage box, a plurality of sets of storage blocks which are distributed at equal intervals in rows are arranged on the left side and the right side of each mounting frame, and each storage block is of an L-shaped structure; a plurality of sets of position detection sensors are arranged in the storage box and located on the rear side of the storage block. According to the device, the wafers can be effectively stored in a sealed mode, the temperature and humidity in the storage environment can be controlled, and the stability of the wafer storage envi</description><subject>BLASTING</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIT0xLLVJIKarMzEtXSEkty0xOVUhKLE5NUcjPU3BLTOJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhiYWJgZG5qGhxkQpAgBZpCVO</recordid><startdate>20240806</startdate><enddate>20240806</enddate><creator>LIU CHUQUN</creator><creator>PAN JINGBO</creator><scope>EVB</scope></search><sort><creationdate>20240806</creationdate><title>Wafer drying device based on Fab</title><author>LIU CHUQUN ; PAN JINGBO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221484027UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU CHUQUN</creatorcontrib><creatorcontrib>PAN JINGBO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU CHUQUN</au><au>PAN JINGBO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer drying device based on Fab</title><date>2024-08-06</date><risdate>2024</risdate><abstract>The wafer drying device based on the Fab comprises a device body, the device body comprises a base, a storage box and a control box, the storage box is installed on the top of the base, and the control box is installed on the top of the storage box; the storage box is of a rectangular structure, the interior of the storage box is of a hollow structure, a plurality of sets of mounting frames which are transversely distributed at equal intervals are arranged in the storage box, a plurality of sets of storage blocks which are distributed at equal intervals in rows are arranged on the left side and the right side of each mounting frame, and each storage block is of an L-shaped structure; a plurality of sets of position detection sensors are arranged in the storage box and located on the rear side of the storage block. According to the device, the wafers can be effectively stored in a sealed mode, the temperature and humidity in the storage environment can be controlled, and the stability of the wafer storage envi</abstract><oa>free_for_read</oa></addata></record>
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subjects BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
title Wafer drying device based on Fab
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T21%3A10%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20CHUQUN&rft.date=2024-08-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN221484027UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true