Silicon wafer polishing machine for chip processing

The utility model discloses a silicon wafer polishing machine for chip processing, which comprises a table top, a fixing plate arranged at the top of the table top, a lifting plate movably connected with the fixing plate, a mounting plate mounted at the bottom of the table top, a first motor mounted...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHE TONGSHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!