Silicon wafer polishing machine for chip processing

The utility model discloses a silicon wafer polishing machine for chip processing, which comprises a table top, a fixing plate arranged at the top of the table top, a lifting plate movably connected with the fixing plate, a mounting plate mounted at the bottom of the table top, a first motor mounted on the mounting plate, a lead screw fixedly sleeved at the other end of an output shaft of the first motor and extending to the back of the mounting plate. The outer surface of the lead screw is sleeved with a moving block in a threaded mode, the two sides of the moving block are movably connected with limiting plates, the limiting plates are fixedly connected with the mounting plate, an inclined plate is hinged to the top of the moving block, a movable block is hinged to the top of the inclined plate, and the movable block is fixedly connected with the lifting plate. When the lifting device is used, the first motor drives the lead screw to rotate, the lead screw enables the movable block to stably move under the