LED high-precision die bonding identification device and circuit
The utility model belongs to the technical field of LED production, and particularly relates to an LED high-precision die bonding identification device and circuit. The device comprises a base, a portal frame mounted above the base, two groups of Y-axis sliding mechanisms mounted on the base, a plac...
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| creator | XU YINGCHANG LIAO YONGJUN JANG HEE-KWANG GONG KE YUE JUNYUE WANG JIANZHONG WANG PENG ZHAO HUA |
| description | The utility model belongs to the technical field of LED production, and particularly relates to an LED high-precision die bonding identification device and circuit. The device comprises a base, a portal frame mounted above the base, two groups of Y-axis sliding mechanisms mounted on the base, a placing plate arranged on the Y-axis sliding mechanisms, and an X-axis sliding mechanism arranged on the portal frame, the two Z-axis sliding mechanisms are installed on the portal frame, the two dispensing mechanisms and the positioning mechanisms are installed on the two Z-axis sliding mechanisms respectively, and each positioning mechanism comprises a photoelectric switch. According to the LED high-precision die bonding recognition device, two groups of dispensing mechanisms are arranged, and a plurality of dispensing heads are arranged on each group of dispensing mechanisms, so that the production efficiency is improved, the position recognition is carried out by adopting the photoelectric switch, the die bonding p |
| format | Patent |
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| language | chi ; eng |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | LED high-precision die bonding identification device and circuit |
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