Vacuum packaging machine for semiconductor parts
The utility model discloses a semiconductor part vacuum packaging machine which comprises a base, an aluminum foil paper packaging box can discharge a piece of aluminum foil packaging paper from an aluminum foil paper outlet, then an aluminum foil paper clamp can clamp the aluminum foil packaging pa...
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| creator | LIU XIN WANG YONGHUA YIN YONG XIONG ANHUA |
| description | The utility model discloses a semiconductor part vacuum packaging machine which comprises a base, an aluminum foil paper packaging box can discharge a piece of aluminum foil packaging paper from an aluminum foil paper outlet, then an aluminum foil paper clamp can clamp the aluminum foil packaging paper through an aluminum foil paper placing telescopic rod, and the aluminum foil packaging paper is placed on the base. The aluminum foil paper placing telescopic rod slides downwards through the packaging box sliding rail to place aluminum foil packaging paper on the packaging platform, follow-up packaging work can be facilitated by placing the aluminum foil packaging paper on one side in advance, and then a feeding door is opened to place parts on a supporting plate; a supporting plate can slide on a supporting plate moving sliding groove through clamping connection of a supporting plate clamping and fixing plate and a supporting plate clamping and fixing connecting rod, part feeding is automatically carried out, |
| format | Patent |
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The aluminum foil paper placing telescopic rod slides downwards through the packaging box sliding rail to place aluminum foil packaging paper on the packaging platform, follow-up packaging work can be facilitated by placing the aluminum foil packaging paper on one side in advance, and then a feeding door is opened to place parts on a supporting plate; a supporting plate can slide on a supporting plate moving sliding groove through clamping connection of a supporting plate clamping and fixing plate and a supporting plate clamping and fixing connecting rod, part feeding is automatically carried out,</description><language>chi ; eng</language><subject>CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING ; UNPACKING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240719&DB=EPODOC&CC=CN&NR=221367694U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240719&DB=EPODOC&CC=CN&NR=221367694U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU XIN</creatorcontrib><creatorcontrib>WANG YONGHUA</creatorcontrib><creatorcontrib>YIN YONG</creatorcontrib><creatorcontrib>XIONG ANHUA</creatorcontrib><title>Vacuum packaging machine for semiconductor parts</title><description>The utility model discloses a semiconductor part vacuum packaging machine which comprises a base, an aluminum foil paper packaging box can discharge a piece of aluminum foil packaging paper from an aluminum foil paper outlet, then an aluminum foil paper clamp can clamp the aluminum foil packaging paper through an aluminum foil paper placing telescopic rod, and the aluminum foil packaging paper is placed on the base. The aluminum foil paper placing telescopic rod slides downwards through the packaging box sliding rail to place aluminum foil packaging paper on the packaging platform, follow-up packaging work can be facilitated by placing the aluminum foil packaging paper on one side in advance, and then a feeding door is opened to place parts on a supporting plate; a supporting plate can slide on a supporting plate moving sliding groove through clamping connection of a supporting plate clamping and fixing plate and a supporting plate clamping and fixing connecting rod, part feeding is automatically carried out,</description><subject>CONVEYING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>STORING</subject><subject>TRANSPORTING</subject><subject>UNPACKING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIS0wuLc1VKEhMzk5Mz8xLV8hNTM7IzEtVSMsvUihOzc1Mzs9LKU0uAfIKEotKinkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGox0JzUvNSSeGc_IyNDYzNzM0uT0FBjohQBANoQLHY</recordid><startdate>20240719</startdate><enddate>20240719</enddate><creator>LIU XIN</creator><creator>WANG YONGHUA</creator><creator>YIN YONG</creator><creator>XIONG ANHUA</creator><scope>EVB</scope></search><sort><creationdate>20240719</creationdate><title>Vacuum packaging machine for semiconductor parts</title><author>LIU XIN ; WANG YONGHUA ; YIN YONG ; XIONG ANHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221367694UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CONVEYING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>STORING</topic><topic>TRANSPORTING</topic><topic>UNPACKING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU XIN</creatorcontrib><creatorcontrib>WANG YONGHUA</creatorcontrib><creatorcontrib>YIN YONG</creatorcontrib><creatorcontrib>XIONG ANHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU XIN</au><au>WANG YONGHUA</au><au>YIN YONG</au><au>XIONG ANHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Vacuum packaging machine for semiconductor parts</title><date>2024-07-19</date><risdate>2024</risdate><abstract>The utility model discloses a semiconductor part vacuum packaging machine which comprises a base, an aluminum foil paper packaging box can discharge a piece of aluminum foil packaging paper from an aluminum foil paper outlet, then an aluminum foil paper clamp can clamp the aluminum foil packaging paper through an aluminum foil paper placing telescopic rod, and the aluminum foil packaging paper is placed on the base. 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| language | chi ; eng |
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| subjects | CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKING PERFORMING OPERATIONS STORING TRANSPORTING UNPACKING |
| title | Vacuum packaging machine for semiconductor parts |
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