Device for improving laminating precision of silicon wafer

The utility model discloses a device for improving the laminating precision of a silicon wafer. The device comprises a positioning base and a positioning ring sleeved on the outer side of the positioning base, the positioning base is provided with a plurality of positioning pins, and the positioning...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHONG YOUSHENG, HOU GUOHUI, HUANG YUXUAN, SUN YAOWEI, WU HONGMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!