Device for improving laminating precision of silicon wafer

Device for improving laminating precision of silicon wafer

The utility model discloses a device for improving the laminating precision of a silicon wafer. The device comprises a positioning base and a positioning ring sleeved on the outer side of the positioning base, the positioning base is provided with a plurality of positioning pins, and the positioning...

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Hauptverfasser: ZHONG YOUSHENG, HOU GUOHUI, HUANG YUXUAN, SUN YAOWEI, WU HONGMING
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZHONG YOUSHENG
HOU GUOHUI
HUANG YUXUAN
SUN YAOWEI
WU HONGMING
description The utility model discloses a device for improving the laminating precision of a silicon wafer. The device comprises a positioning base and a positioning ring sleeved on the outer side of the positioning base, the positioning base is provided with a plurality of positioning pins, and the positioning pins are used for positioning a silicon wafer to ensure that the positioned silicon wafer and the positioning base are kept in a concentric state; a plurality of positioning blocks are arranged on the positioning ring, each positioning block comprises a horizontal block and a baffle located above the horizontal block, the horizontal blocks are used for horizontally supporting the block, the baffles are used for positioning the block, and it is ensured that the positioned block and the positioning ring are kept in a concentric state. The device provided by the utility model is simple to manufacture, low in cost and simple to operate, and can solve the problem of deviation when a block fits a silicon wafer on a base
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Device for improving laminating precision of silicon wafer
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