Chip high and low temperature test equipment
The utility model discloses chip high and low temperature test equipment, which comprises a mainboard assembly and an airflow input assembly, the mainboard assembly comprises a main circuit board and a test circuit board, the main circuit board is connected with the side surface of the test circuit...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses chip high and low temperature test equipment, which comprises a mainboard assembly and an airflow input assembly, the mainboard assembly comprises a main circuit board and a test circuit board, the main circuit board is connected with the side surface of the test circuit board, and the upper end of the test circuit board is only connected with a plurality of chip test seats for installing chips; the airflow input assembly comprises an airflow instrument, the output end of the airflow instrument is slidably provided with an airflow cover used for covering the upper end of the test circuit board in the vertical direction, the output end of the airflow instrument is communicated with the airflow cover, and the main circuit board is electrically connected with an upper computer. According to the utility model, only the test circuit board and the chip test seat on the test circuit board are arranged in the air flow cover, and the main circuit board and the components which are not resis |
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