Cover film electroplating clamping point position mold

The utility model discloses a cover film electroplating clamping point position mold which comprises a top plate and a bottom plate which are arranged up and down, and the bottom plate is provided with at least two through holes and at least two positioning pieces; avoiding holes and punches are arranged on the top plate, the number of the avoiding holes is equal to that of the positioning pieces, the avoiding holes and the positioning pieces are arranged in a one-to-one correspondence mode, the positioning pieces are matched with preset positioning holes in the covering film, the number of the punches is equal to that of the through holes, and the punches and the through holes are arranged in a one-to-one correspondence mode; and the outer wall of the punch is matched with the side wall of the through hole so as to punch electroplating clamping point positions on the cover film. And the punches are matched with the through holes, waste materials with the same shape as the needed electroplating clamping point