BMS control panel and battery pack
The utility model discloses a BMS control panel and a battery pack. The BMS control panel comprises a circuit board body; the MOS component is arranged on one surface of the circuit board body; and the radiator is arranged on the other surface of the circuit board body and is opposite to the positio...
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| creator | MO XIBAO CHEN YOUZHANG CHEN HUI ZHAO WENBIN XU JIECHENG XU LIUYAN |
| description | The utility model discloses a BMS control panel and a battery pack. The BMS control panel comprises a circuit board body; the MOS component is arranged on one surface of the circuit board body; and the radiator is arranged on the other surface of the circuit board body and is opposite to the position of the MOS component. According to the BMS control panel, the MOS component is innovatively arranged on one side of the circuit board body, and then the radiator is arranged on the other side, opposite to the MOS component, of the circuit board body; the heat emitted by the MOS component can be quickly conducted to the circuit board body through the metal pin directly connected with the circuit board body, and then the heat conducted to the circuit board body is quickly dissipated to the outside through the radiator. The heat dissipated by the MOS component is directly conducted outwards to the radiator through the metal pin of the MOS component, the heat dissipation is rapid, uniform and comprehensive, the effec |
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The BMS control panel comprises a circuit board body; the MOS component is arranged on one surface of the circuit board body; and the radiator is arranged on the other surface of the circuit board body and is opposite to the position of the MOS component. According to the BMS control panel, the MOS component is innovatively arranged on one side of the circuit board body, and then the radiator is arranged on the other side, opposite to the MOS component, of the circuit board body; the heat emitted by the MOS component can be quickly conducted to the circuit board body through the metal pin directly connected with the circuit board body, and then the heat conducted to the circuit board body is quickly dissipated to the outside through the radiator. The heat dissipated by the MOS component is directly conducted outwards to the radiator through the metal pin of the MOS component, the heat dissipation is rapid, uniform and comprehensive, the effec</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=220985938U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=220985938U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MO XIBAO</creatorcontrib><creatorcontrib>CHEN YOUZHANG</creatorcontrib><creatorcontrib>CHEN HUI</creatorcontrib><creatorcontrib>ZHAO WENBIN</creatorcontrib><creatorcontrib>XU JIECHENG</creatorcontrib><creatorcontrib>XU LIUYAN</creatorcontrib><title>BMS control panel and battery pack</title><description>The utility model discloses a BMS control panel and a battery pack. The BMS control panel comprises a circuit board body; the MOS component is arranged on one surface of the circuit board body; and the radiator is arranged on the other surface of the circuit board body and is opposite to the position of the MOS component. According to the BMS control panel, the MOS component is innovatively arranged on one side of the circuit board body, and then the radiator is arranged on the other side, opposite to the MOS component, of the circuit board body; the heat emitted by the MOS component can be quickly conducted to the circuit board body through the metal pin directly connected with the circuit board body, and then the heat conducted to the circuit board body is quickly dissipated to the outside through the radiator. The heat dissipated by the MOS component is directly conducted outwards to the radiator through the metal pin of the MOS component, the heat dissipation is rapid, uniform and comprehensive, the effec</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBy8g1WSM7PKynKz1EoSMxLzVFIzEtRSEosKUktqgSKJGfzMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjUYqCS1LzUknhnPyMjA0sLU0tji9BQY6IUAQDAwSZZ</recordid><startdate>20240517</startdate><enddate>20240517</enddate><creator>MO XIBAO</creator><creator>CHEN YOUZHANG</creator><creator>CHEN HUI</creator><creator>ZHAO WENBIN</creator><creator>XU JIECHENG</creator><creator>XU LIUYAN</creator><scope>EVB</scope></search><sort><creationdate>20240517</creationdate><title>BMS control panel and battery pack</title><author>MO XIBAO ; CHEN YOUZHANG ; CHEN HUI ; ZHAO WENBIN ; XU JIECHENG ; XU LIUYAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220985938UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><toplevel>online_resources</toplevel><creatorcontrib>MO XIBAO</creatorcontrib><creatorcontrib>CHEN YOUZHANG</creatorcontrib><creatorcontrib>CHEN HUI</creatorcontrib><creatorcontrib>ZHAO WENBIN</creatorcontrib><creatorcontrib>XU JIECHENG</creatorcontrib><creatorcontrib>XU LIUYAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MO XIBAO</au><au>CHEN YOUZHANG</au><au>CHEN HUI</au><au>ZHAO WENBIN</au><au>XU JIECHENG</au><au>XU LIUYAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BMS control panel and battery pack</title><date>2024-05-17</date><risdate>2024</risdate><abstract>The utility model discloses a BMS control panel and a battery pack. The BMS control panel comprises a circuit board body; the MOS component is arranged on one surface of the circuit board body; and the radiator is arranged on the other surface of the circuit board body and is opposite to the position of the MOS component. According to the BMS control panel, the MOS component is innovatively arranged on one side of the circuit board body, and then the radiator is arranged on the other side, opposite to the MOS component, of the circuit board body; the heat emitted by the MOS component can be quickly conducted to the circuit board body through the metal pin directly connected with the circuit board body, and then the heat conducted to the circuit board body is quickly dissipated to the outside through the radiator. The heat dissipated by the MOS component is directly conducted outwards to the radiator through the metal pin of the MOS component, the heat dissipation is rapid, uniform and comprehensive, the effec</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY |
| title | BMS control panel and battery pack |
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