Substrate processing apparatus
The utility model relates to a substrate processing device, and provides a technology for inhibiting the attachment of dirt in the internal space of a main shaft cover. The substrate processing apparatus includes a drive mechanism for driving a tool for processing a substrate. The drive mechanism is...
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| creator | KODAMA MUNEHISA WAKAMATSU TAKAAKI |
| description | The utility model relates to a substrate processing device, and provides a technology for inhibiting the attachment of dirt in the internal space of a main shaft cover. The substrate processing apparatus includes a drive mechanism for driving a tool for processing a substrate. The drive mechanism is provided with a motor, a vertical main shaft rotated by the motor, and a main shaft cover surrounding the main shaft. The main shaft cover is provided with: a first cylindrical part surrounding the main shaft; a second cylindrical part surrounding the first cylindrical part; and an annular top plate part that blocks an inner space formed between the first cylindrical part and the second cylindrical part from above. The top plate part or the upper part of the second cylindrical part is provided with a suction port for sucking air from the external space of the main shaft cover to the internal space of the main shaft cover.
本实用新型涉及基板处理装置，提供一种抑制主轴罩的内部空间的污垢的附着的技术。基板处理装置具备驱动机构，该驱动机构用于驱动对基板进行加工的工具。所述驱动机构具备马达、利用所述马达进行旋转的 |
| format | Patent |
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本实用新型涉及基板处理装置，提供一种抑制主轴罩的内部空间的污垢的附着的技术。基板处理装置具备驱动机构，该驱动机构用于驱动对基板进行加工的工具。所述驱动机构具备马达、利用所述马达进行旋转的</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=220971725U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=220971725U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KODAMA MUNEHISA</creatorcontrib><creatorcontrib>WAKAMATSU TAKAAKI</creatorcontrib><title>Substrate processing apparatus</title><description>The utility model relates to a substrate processing device, and provides a technology for inhibiting the attachment of dirt in the internal space of a main shaft cover. The substrate processing apparatus includes a drive mechanism for driving a tool for processing a substrate. The drive mechanism is provided with a motor, a vertical main shaft rotated by the motor, and a main shaft cover surrounding the main shaft. The main shaft cover is provided with: a first cylindrical part surrounding the main shaft; a second cylindrical part surrounding the first cylindrical part; and an annular top plate part that blocks an inner space formed between the first cylindrical part and the second cylindrical part from above. The top plate part or the upper part of the second cylindrical part is provided with a suction port for sucking air from the external space of the main shaft cover to the internal space of the main shaft cover.
本实用新型涉及基板处理装置，提供一种抑制主轴罩的内部空间的污垢的附着的技术。基板处理装置具备驱动机构，该驱动机构用于驱动对基板进行加工的工具。所述驱动机构具备马达、利用所述马达进行旋转的</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALLk0qLilKLElVKCjKT04tLs7MS1dILChIBIqVFvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknhnPyMjA0tzQ3Mj09BQY6IUAQCEliXq</recordid><startdate>20240517</startdate><enddate>20240517</enddate><creator>KODAMA MUNEHISA</creator><creator>WAKAMATSU TAKAAKI</creator><scope>EVB</scope></search><sort><creationdate>20240517</creationdate><title>Substrate processing apparatus</title><author>KODAMA MUNEHISA ; WAKAMATSU TAKAAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220971725UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KODAMA MUNEHISA</creatorcontrib><creatorcontrib>WAKAMATSU TAKAAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KODAMA MUNEHISA</au><au>WAKAMATSU TAKAAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate processing apparatus</title><date>2024-05-17</date><risdate>2024</risdate><abstract>The utility model relates to a substrate processing device, and provides a technology for inhibiting the attachment of dirt in the internal space of a main shaft cover. The substrate processing apparatus includes a drive mechanism for driving a tool for processing a substrate. The drive mechanism is provided with a motor, a vertical main shaft rotated by the motor, and a main shaft cover surrounding the main shaft. The main shaft cover is provided with: a first cylindrical part surrounding the main shaft; a second cylindrical part surrounding the first cylindrical part; and an annular top plate part that blocks an inner space formed between the first cylindrical part and the second cylindrical part from above. The top plate part or the upper part of the second cylindrical part is provided with a suction port for sucking air from the external space of the main shaft cover to the internal space of the main shaft cover.
本实用新型涉及基板处理装置，提供一种抑制主轴罩的内部空间的污垢的附着的技术。基板处理装置具备驱动机构，该驱动机构用于驱动对基板进行加工的工具。所述驱动机构具备马达、利用所述马达进行旋转的</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN220971725UU |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Substrate processing apparatus |
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