Perforating device for integrated circuit board production

The utility model discloses a punching device for integrated circuit board production, which comprises a machine body, a machine chamber is arranged in the machine body, a punching driving component is arranged on the inner wall of the top side of the machine chamber, a collecting groove is formed i...

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Hauptverfasser: XIE YANHU, JIANG FENGYONG, PENG CHUAN
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Sprache:chi ; eng
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creator XIE YANHU
JIANG FENGYONG
PENG CHUAN
description The utility model discloses a punching device for integrated circuit board production, which comprises a machine body, a machine chamber is arranged in the machine body, a punching driving component is arranged on the inner wall of the top side of the machine chamber, a collecting groove is formed in the inner wall of the bottom side of the machine chamber, and the same processing seat is fixedly mounted in the collecting groove through a plurality of connecting plates. Two fixing plates are fixedly installed on the top side of the machining base, clamping plates are installed on the fixing plates through adjusting assemblies, a mounting groove is formed in the inner wall of the bottom side of the machine chamber, a second motor is started, a rotating rod drives a gear to rotate, and due to the fact that the gear is meshed with a mounting gear ring, two air spraying heads can be driven to do small-amplitude reciprocating rotation; according to the integrated circuit board punching device, the two air nozzles
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Two fixing plates are fixedly installed on the top side of the machining base, clamping plates are installed on the fixing plates through adjusting assemblies, a mounting groove is formed in the inner wall of the bottom side of the machine chamber, a second motor is started, a rotating rod drives a gear to rotate, and due to the fact that the gear is meshed with a mounting gear ring, two air spraying heads can be driven to do small-amplitude reciprocating rotation; according to the integrated circuit board punching device, the two air nozzles</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240514&amp;DB=EPODOC&amp;CC=CN&amp;NR=220943670U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240514&amp;DB=EPODOC&amp;CC=CN&amp;NR=220943670U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE YANHU</creatorcontrib><creatorcontrib>JIANG FENGYONG</creatorcontrib><creatorcontrib>PENG CHUAN</creatorcontrib><title>Perforating device for integrated circuit board production</title><description>The utility model discloses a punching device for integrated circuit board production, which comprises a machine body, a machine chamber is arranged in the machine body, a punching driving component is arranged on the inner wall of the top side of the machine chamber, a collecting groove is formed in the inner wall of the bottom side of the machine chamber, and the same processing seat is fixedly mounted in the collecting groove through a plurality of connecting plates. 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language chi ; eng
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Perforating device for integrated circuit board production
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