Heat-conducting gel for chip

The heat-conducting gel for the chip belongs to the technical field of heat-conducting gels, the relatively flat heat-conducting gel sheet is constructed through the middle layer, so that the heat-conducting gel sheet can be perfectly attached to the surface of the chip and cannot diffuse towards the two sides of the chip to cause pollution or sealing, the strength of the whole structure of the middle cover is guaranteed, and the service life of the heat-conducting gel sheet is prolonged. Meanwhile, an efficient heat dissipation effect is achieved, heat of a chip product is transferred outwards through the heat conduction gel, heat dissipation is conducted quickly, meanwhile, the upper gel layer and the lower gel layer form an integral structure through the structure of the communication groove, and stability is higher. 本实用新型的一种芯片用导热凝胶，属于导热凝胶技术领域，通过中间层构建较为平整的导热凝胶片，使其能够完美的贴合芯片的表面，同时也不至于向芯片两边扩散造成污染或者封闭，其中盖整体结构的强度有所保障，同时具备高效的散热效果，将芯片产品的热量通过导热凝胶向外传递，使其快速的进行散热，同时连通槽的结构，使得上层凝胶层和下层凝胶层构成整体结构，稳定性更高。