Electronic module with leak-proof structure
An electronic module with a leakproof structure comprises a carrier plate, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a radiator. The heat source is arranged on the carrier plate. The metal frame is arranged on the carrier plate and surrounds the heat s...
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| creator | ZHAN YIWEN |
| description | An electronic module with a leakproof structure comprises a carrier plate, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a radiator. The heat source is arranged on the carrier plate. The metal frame is arranged on the carrier plate and surrounds the heat source. The elastic isolation part is arranged between the metal frame and the heat source, the elastic isolation part comprises a continuous wall and a substrate, the substrate is connected with the bottom side of the continuous wall, a central opening is formed in the substrate, the heat source corresponds to the central opening, and the continuous wall defines an accommodating space. The liquid metal material is arranged on the heat source, and the elastic isolation component is suitable for limiting flowing of the liquid metal material. The radiator comprises a radiator bottom surface and a boss, and the boss is in contact with the liquid metal material.
一种具有防泄漏结构的电子模块，包括一载板、一热源、一金属框、一弹性隔离部件、一液态金属材以及一散热器。热源设于该载板 |
| format | Patent |
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一种具有防泄漏结构的电子模块，包括一载板、一热源、一金属框、一弹性隔离部件、一液态金属材以及一散热器。热源设于该载板</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240426&DB=EPODOC&CC=CN&NR=220858550U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240426&DB=EPODOC&CC=CN&NR=220858550U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAN YIWEN</creatorcontrib><title>Electronic module with leak-proof structure</title><description>An electronic module with a leakproof structure comprises a carrier plate, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a radiator. The heat source is arranged on the carrier plate. The metal frame is arranged on the carrier plate and surrounds the heat source. The elastic isolation part is arranged between the metal frame and the heat source, the elastic isolation part comprises a continuous wall and a substrate, the substrate is connected with the bottom side of the continuous wall, a central opening is formed in the substrate, the heat source corresponds to the central opening, and the continuous wall defines an accommodating space. The liquid metal material is arranged on the heat source, and the elastic isolation component is suitable for limiting flowing of the liquid metal material. The radiator comprises a radiator bottom surface and a boss, and the boss is in contact with the liquid metal material.
一种具有防泄漏结构的电子模块，包括一载板、一热源、一金属框、一弹性隔离部件、一液态金属材以及一散热器。热源设于该载板</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB2zUlNLinKz8tMVsjNTynNSVUozyzJUMhJTczWLSjKz09TKC4pKk0uKS1K5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkYGFqYWpqYGoaHGRCkCAN49Kpc</recordid><startdate>20240426</startdate><enddate>20240426</enddate><creator>ZHAN YIWEN</creator><scope>EVB</scope></search><sort><creationdate>20240426</creationdate><title>Electronic module with leak-proof structure</title><author>ZHAN YIWEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220858550UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAN YIWEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAN YIWEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic module with leak-proof structure</title><date>2024-04-26</date><risdate>2024</risdate><abstract>An electronic module with a leakproof structure comprises a carrier plate, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a radiator. The heat source is arranged on the carrier plate. The metal frame is arranged on the carrier plate and surrounds the heat source. The elastic isolation part is arranged between the metal frame and the heat source, the elastic isolation part comprises a continuous wall and a substrate, the substrate is connected with the bottom side of the continuous wall, a central opening is formed in the substrate, the heat source corresponds to the central opening, and the continuous wall defines an accommodating space. The liquid metal material is arranged on the heat source, and the elastic isolation component is suitable for limiting flowing of the liquid metal material. The radiator comprises a radiator bottom surface and a boss, and the boss is in contact with the liquid metal material.
一种具有防泄漏结构的电子模块，包括一载板、一热源、一金属框、一弹性隔离部件、一液态金属材以及一散热器。热源设于该载板</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | Electronic module with leak-proof structure |
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