Novel low stray inductance vehicle power module
A novel low stray inductance vehicle power module mainly comprises a pin fin heat dissipation substrate, an injection molding shell and a power module main body arranged in the injection molding shell, and is characterized in that the pin fin heat dissipation substrate adopts pin fins to be immersed...
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| creator | OU DONGYING |
| description | A novel low stray inductance vehicle power module mainly comprises a pin fin heat dissipation substrate, an injection molding shell and a power module main body arranged in the injection molding shell, and is characterized in that the pin fin heat dissipation substrate adopts pin fins to be immersed in water for direct water cooling, and the power module main body comprises a circuit module and a heat dissipation substrate, the circuit module comprises a double-sided copper-clad ceramic plate, an IGBT chip, a diode chip, an NTC resistor and a Pin. The IGBT chip, the diode chip, the NTC resistor and the Pin are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the injection molding shell are connected with one another through wires. The double-sided copper-clad ceramic plate is fixed on the pin-fin heat dissipation substrate, and the injection molding shell is fixed on the pin-fin heat dissipation substrate through epoxy seala |
| format | Patent |
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The IGBT chip, the diode chip, the NTC resistor and the Pin are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the injection molding shell are connected with one another through wires. 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The IGBT chip, the diode chip, the NTC resistor and the Pin are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the injection molding shell are connected with one another through wires. 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The IGBT chip, the diode chip, the NTC resistor and the Pin are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the injection molding shell are connected with one another through wires. The double-sided copper-clad ceramic plate is fixed on the pin-fin heat dissipation substrate, and the injection molding shell is fixed on the pin-fin heat dissipation substrate through epoxy seala</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Novel low stray inductance vehicle power module |
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