Spot plating device

Spot plating device

The utility model relates to the field of communication connector processing, in particular to a spot plating device. The spot plating device comprises a machine body, a mold is installed on one side of the machine body, a guide wheel is further rotationally connected to one side of the machine body...

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Hauptverfasser: QIN QINGJUN, SUN XIAOLONG, LI PING, LI JINXIN
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator QIN QINGJUN
SUN XIAOLONG
LI PING
LI JINXIN
description The utility model relates to the field of communication connector processing, in particular to a spot plating device. The spot plating device comprises a machine body, a mold is installed on one side of the machine body, a guide wheel is further rotationally connected to one side of the machine body, a pressing belt is further arranged on the mold and the guide wheel in a penetrating mode, the spot plating device further comprises a tensioning adjusting wheel and a driving device, and the tensioning adjusting wheel is movably connected to one side of the machine body; the adjusting assembly is fixed to one side of the machine body, and a mounting seat sliding on the machine body is further fixed to the adjusting assembly; wherein the tensioning adjusting wheel is rotationally connected to the mounting base, and the mounting base and the tensioning adjusting wheel are driven by the adjusting assembly to move in the vertical direction. According to the spot plating device provided by the utility model, the tens
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220812668UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220812668UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220812668UU3</originalsourceid><addsrcrecordid>eNrjZBAOLsgvUSjISSzJzEtXSEkty0xO5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkYGFoZGZmYWoaHGRCkCAF8nIRk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Spot plating device</title><source>esp@cenet</source><creator>QIN QINGJUN ; SUN XIAOLONG ; LI PING ; LI JINXIN</creator><creatorcontrib>QIN QINGJUN ; SUN XIAOLONG ; LI PING ; LI JINXIN</creatorcontrib><description>The utility model relates to the field of communication connector processing, in particular to a spot plating device. The spot plating device comprises a machine body, a mold is installed on one side of the machine body, a guide wheel is further rotationally connected to one side of the machine body, a pressing belt is further arranged on the mold and the guide wheel in a penetrating mode, the spot plating device further comprises a tensioning adjusting wheel and a driving device, and the tensioning adjusting wheel is movably connected to one side of the machine body; the adjusting assembly is fixed to one side of the machine body, and a mounting seat sliding on the machine body is further fixed to the adjusting assembly; wherein the tensioning adjusting wheel is rotationally connected to the mounting base, and the mounting base and the tensioning adjusting wheel are driven by the adjusting assembly to move in the vertical direction. According to the spot plating device provided by the utility model, the tens</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240419&amp;DB=EPODOC&amp;CC=CN&amp;NR=220812668U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240419&amp;DB=EPODOC&amp;CC=CN&amp;NR=220812668U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIN QINGJUN</creatorcontrib><creatorcontrib>SUN XIAOLONG</creatorcontrib><creatorcontrib>LI PING</creatorcontrib><creatorcontrib>LI JINXIN</creatorcontrib><title>Spot plating device</title><description>The utility model relates to the field of communication connector processing, in particular to a spot plating device. The spot plating device comprises a machine body, a mold is installed on one side of the machine body, a guide wheel is further rotationally connected to one side of the machine body, a pressing belt is further arranged on the mold and the guide wheel in a penetrating mode, the spot plating device further comprises a tensioning adjusting wheel and a driving device, and the tensioning adjusting wheel is movably connected to one side of the machine body; the adjusting assembly is fixed to one side of the machine body, and a mounting seat sliding on the machine body is further fixed to the adjusting assembly; wherein the tensioning adjusting wheel is rotationally connected to the mounting base, and the mounting base and the tensioning adjusting wheel are driven by the adjusting assembly to move in the vertical direction. According to the spot plating device provided by the utility model, the tens</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAOLsgvUSjISSzJzEtXSEkty0xO5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkYGFoZGZmYWoaHGRCkCAF8nIRk</recordid><startdate>20240419</startdate><enddate>20240419</enddate><creator>QIN QINGJUN</creator><creator>SUN XIAOLONG</creator><creator>LI PING</creator><creator>LI JINXIN</creator><scope>EVB</scope></search><sort><creationdate>20240419</creationdate><title>Spot plating device</title><author>QIN QINGJUN ; SUN XIAOLONG ; LI PING ; LI JINXIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220812668UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>QIN QINGJUN</creatorcontrib><creatorcontrib>SUN XIAOLONG</creatorcontrib><creatorcontrib>LI PING</creatorcontrib><creatorcontrib>LI JINXIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIN QINGJUN</au><au>SUN XIAOLONG</au><au>LI PING</au><au>LI JINXIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Spot plating device</title><date>2024-04-19</date><risdate>2024</risdate><abstract>The utility model relates to the field of communication connector processing, in particular to a spot plating device. The spot plating device comprises a machine body, a mold is installed on one side of the machine body, a guide wheel is further rotationally connected to one side of the machine body, a pressing belt is further arranged on the mold and the guide wheel in a penetrating mode, the spot plating device further comprises a tensioning adjusting wheel and a driving device, and the tensioning adjusting wheel is movably connected to one side of the machine body; the adjusting assembly is fixed to one side of the machine body, and a mounting seat sliding on the machine body is further fixed to the adjusting assembly; wherein the tensioning adjusting wheel is rotationally connected to the mounting base, and the mounting base and the tensioning adjusting wheel are driven by the adjusting assembly to move in the vertical direction. According to the spot plating device provided by the utility model, the tens</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Spot plating device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T03%3A22%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=QIN%20QINGJUN&rft.date=2024-04-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220812668UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true