Crystal bar wire cutting equipment for semiconductor integrated circuit chip

The utility model discloses crystal bar wire cutting equipment for a semiconductor integrated circuit chip, which comprises an operation table, and a wire cutting machine is arranged at the top of the operation table. Then, a worker holds a pull ring by hand to drive an insertion rod to be pulled out from the inner sides of a pulling plate and a guide groove, and meanwhile, the worker holds a holding ring by hand to drive the pulling plate to move towards the back face, so that the pulling plate moves along the guide groove through a guide rod under the limiting effect of a circular plate; when the square box or the drawing plate needs to be cleaned, a user can hold the supporting ring by hand to drive the square box and the drawing plate to be taken down from the inner side of the device to be cleaned through the bent rod, and therefore the square box or the drawing plate can be cleaned. And therefore, the device can conveniently collect and clean the scraps. 本实用新型公开了一种半导体集成电路芯片用晶棒线切割设备，包括操作台，所述操作台的顶部安装有线切割机