VPX case
The utility model provides a VPX case, and relates to the field of VPX cases. The utility model provides a VPX chassis, which comprises a chassis shell and a printed board module, a terminal board is arranged on one side of the chassis shell, and a mother board is arranged between the terminal board...
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| creator | YE XIANGBIN CHEN ZIYU XIAO WENXU HUANG JIACHAO |
| description | The utility model provides a VPX case, and relates to the field of VPX cases. The utility model provides a VPX chassis, which comprises a chassis shell and a printed board module, a terminal board is arranged on one side of the chassis shell, and a mother board is arranged between the terminal board and the chassis shell; the printed board modules are clamped in the case shell, the multiple printed board modules are connected with the mother board, and a heat pipe heat dissipation system is arranged on each printed board module. The heat pipe heat dissipation system is arranged on the printed board module, and heat dissipation is carried out on the printed board through the heat pipe heat dissipation system; fins are arranged on the case shell, so that heat dissipation is further facilitated; the structure of the high-power VPX case is simplified to a certain extent, and the heat dissipation efficiency is improved.
本实用新型提出一种VPX机箱，涉及VPX机箱领域。本实用新型提出的一种VPX机箱，包括机箱壳体和印制板模组，所述机箱壳体一侧为端子板，所述端子板与所述机箱壳体之间设有母板；所述印制板模组卡接 |
| format | Patent |
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本实用新型提出一种VPX机箱，涉及VPX机箱领域。本实用新型提出的一种VPX机箱，包括机箱壳体和印制板模组，所述机箱壳体一侧为端子板，所述端子板与所述机箱壳体之间设有母板；所述印制板模组卡接</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240412&DB=EPODOC&CC=CN&NR=220776330U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240412&DB=EPODOC&CC=CN&NR=220776330U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YE XIANGBIN</creatorcontrib><creatorcontrib>CHEN ZIYU</creatorcontrib><creatorcontrib>XIAO WENXU</creatorcontrib><creatorcontrib>HUANG JIACHAO</creatorcontrib><title>VPX case</title><description>The utility model provides a VPX case, and relates to the field of VPX cases. The utility model provides a VPX chassis, which comprises a chassis shell and a printed board module, a terminal board is arranged on one side of the chassis shell, and a mother board is arranged between the terminal board and the chassis shell; the printed board modules are clamped in the case shell, the multiple printed board modules are connected with the mother board, and a heat pipe heat dissipation system is arranged on each printed board module. The heat pipe heat dissipation system is arranged on the printed board module, and heat dissipation is carried out on the printed board through the heat pipe heat dissipation system; fins are arranged on the case shell, so that heat dissipation is further facilitated; the structure of the high-power VPX case is simplified to a certain extent, and the heat dissipation efficiency is improved.
本实用新型提出一种VPX机箱，涉及VPX机箱领域。本实用新型提出的一种VPX机箱，包括机箱壳体和印制板模组，所述机箱壳体一侧为端子板，所述端子板与所述机箱壳体之间设有母板；所述印制板模组卡接</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAIC4hQSE4sTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBubmZsbGBqGhxkQpAgCDNRx5</recordid><startdate>20240412</startdate><enddate>20240412</enddate><creator>YE XIANGBIN</creator><creator>CHEN ZIYU</creator><creator>XIAO WENXU</creator><creator>HUANG JIACHAO</creator><scope>EVB</scope></search><sort><creationdate>20240412</creationdate><title>VPX case</title><author>YE XIANGBIN ; CHEN ZIYU ; XIAO WENXU ; HUANG JIACHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220776330UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YE XIANGBIN</creatorcontrib><creatorcontrib>CHEN ZIYU</creatorcontrib><creatorcontrib>XIAO WENXU</creatorcontrib><creatorcontrib>HUANG JIACHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YE XIANGBIN</au><au>CHEN ZIYU</au><au>XIAO WENXU</au><au>HUANG JIACHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VPX case</title><date>2024-04-12</date><risdate>2024</risdate><abstract>The utility model provides a VPX case, and relates to the field of VPX cases. The utility model provides a VPX chassis, which comprises a chassis shell and a printed board module, a terminal board is arranged on one side of the chassis shell, and a mother board is arranged between the terminal board and the chassis shell; the printed board modules are clamped in the case shell, the multiple printed board modules are connected with the mother board, and a heat pipe heat dissipation system is arranged on each printed board module. The heat pipe heat dissipation system is arranged on the printed board module, and heat dissipation is carried out on the printed board through the heat pipe heat dissipation system; fins are arranged on the case shell, so that heat dissipation is further facilitated; the structure of the high-power VPX case is simplified to a certain extent, and the heat dissipation efficiency is improved.
本实用新型提出一种VPX机箱，涉及VPX机箱领域。本实用新型提出的一种VPX机箱，包括机箱壳体和印制板模组，所述机箱壳体一侧为端子板，所述端子板与所述机箱壳体之间设有母板；所述印制板模组卡接</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN220776330UU |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | VPX case |
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