SOP36 plastic package structure

SOP36 plastic package structure

The utility model relates to an SOP36 plastic package structure, which comprises a radiating fin body, the inner side of the radiating fin body is positioned in a plastic package body and is in contact with a chip through a substrate of a lead frame, the outer side of the radiating fin body is parti...

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Hauptverfasser: SHAO JIMING, YUAN HONGCHENG
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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YUAN HONGCHENG
description The utility model relates to an SOP36 plastic package structure, which comprises a radiating fin body, the inner side of the radiating fin body is positioned in a plastic package body and is in contact with a chip through a substrate of a lead frame, the outer side of the radiating fin body is partially exposed outside the plastic package body, the left side and the right side of the radiating fin body are provided with positioning shoulders for positioning the plastic package body, and the positioning shoulders are arranged on the left side and the right side of the radiating fin body. An inner step and an outer step are arranged on the inner side and the outer side of the cooling fin body respectively, the SOP36 plastic package structure is good in cooling effect, the bonding strength of the cooling fin, the plastic package body and the lead frame is high, and installation is firm. 本实用新型涉及一种SOP36塑封结构，包括散热片体，所述散热片体内侧位于塑封体内，且所述散热片体内侧通过引线框架的基板与芯片接触，所述散热片体外侧部分裸露在塑封体外侧，所述散热片体左、右两侧设置定位塑封体的定位凸肩，所述散热片体内侧外侧分别设置内台阶和外
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An inner step and an outer step are arranged on the inner side and the outer side of the cooling fin body respectively, the SOP36 plastic package structure is good in cooling effect, the bonding strength of the cooling fin, the plastic package body and the lead frame is high, and installation is firm. 本实用新型涉及一种SOP36塑封结构，包括散热片体，所述散热片体内侧位于塑封体内，且所述散热片体内侧通过引线框架的基板与芯片接触，所述散热片体外侧部分裸露在塑封体外侧，所述散热片体左、右两侧设置定位塑封体的定位凸肩，所述散热片体内侧外侧分别设置内台阶和外</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240405&amp;DB=EPODOC&amp;CC=CN&amp;NR=220731520U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240405&amp;DB=EPODOC&amp;CC=CN&amp;NR=220731520U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO JIMING</creatorcontrib><creatorcontrib>YUAN HONGCHENG</creatorcontrib><title>SOP36 plastic package structure</title><description>The utility model relates to an SOP36 plastic package structure, which comprises a radiating fin body, the inner side of the radiating fin body is positioned in a plastic package body and is in contact with a chip through a substrate of a lead frame, the outer side of the radiating fin body is partially exposed outside the plastic package body, the left side and the right side of the radiating fin body are provided with positioning shoulders for positioning the plastic package body, and the positioning shoulders are arranged on the left side and the right side of the radiating fin body. 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An inner step and an outer step are arranged on the inner side and the outer side of the cooling fin body respectively, the SOP36 plastic package structure is good in cooling effect, the bonding strength of the cooling fin, the plastic package body and the lead frame is high, and installation is firm. 本实用新型涉及一种SOP36塑封结构，包括散热片体，所述散热片体内侧位于塑封体内，且所述散热片体内侧通过引线框架的基板与芯片接触，所述散热片体外侧部分裸露在塑封体外侧，所述散热片体左、右两侧设置定位塑封体的定位凸肩，所述散热片体内侧外侧分别设置内台阶和外</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SOP36 plastic package structure
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