SOP lead frame

The utility model relates to an SOP lead frame, which comprises side ribs on two sides, a plurality of lead frame units are connected between the side ribs, each lead frame unit comprises a middle slide island, the slide island is connected with two side ribs through connecting ribs on two sides, an...

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Hauptverfasser: SHAO JIMING, YUAN HONGCHENG
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creator SHAO JIMING
YUAN HONGCHENG
description The utility model relates to an SOP lead frame, which comprises side ribs on two sides, a plurality of lead frame units are connected between the side ribs, each lead frame unit comprises a middle slide island, the slide island is connected with two side ribs through connecting ribs on two sides, and fourteen outer pins are respectively arranged on two sides of the slide island. The outer pins are connected between the two side ribs through the middle rib, the inner ends of all the outer pins bend and extend towards the direction of the slide island, so that the inner ends of all the outer pins wrap the periphery of the slide island, one end, close to the slide island, of each outer pin is provided with a bonding area, the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island, and the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island. The length of the bonding wire can be reduced, the bonding cost is saved, the risk of fractur
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220731519UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220731519UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220731519UU3</originalsourceid><addsrcrecordid>eNrjZOAL9g9QyElNTFFIK0rMTeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBubGhqaGlqGhxkQpAgBZSh6Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOP lead frame</title><source>esp@cenet</source><creator>SHAO JIMING ; YUAN HONGCHENG</creator><creatorcontrib>SHAO JIMING ; YUAN HONGCHENG</creatorcontrib><description>The utility model relates to an SOP lead frame, which comprises side ribs on two sides, a plurality of lead frame units are connected between the side ribs, each lead frame unit comprises a middle slide island, the slide island is connected with two side ribs through connecting ribs on two sides, and fourteen outer pins are respectively arranged on two sides of the slide island. The outer pins are connected between the two side ribs through the middle rib, the inner ends of all the outer pins bend and extend towards the direction of the slide island, so that the inner ends of all the outer pins wrap the periphery of the slide island, one end, close to the slide island, of each outer pin is provided with a bonding area, the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island, and the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island. The length of the bonding wire can be reduced, the bonding cost is saved, the risk of fractur</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240405&amp;DB=EPODOC&amp;CC=CN&amp;NR=220731519U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240405&amp;DB=EPODOC&amp;CC=CN&amp;NR=220731519U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO JIMING</creatorcontrib><creatorcontrib>YUAN HONGCHENG</creatorcontrib><title>SOP lead frame</title><description>The utility model relates to an SOP lead frame, which comprises side ribs on two sides, a plurality of lead frame units are connected between the side ribs, each lead frame unit comprises a middle slide island, the slide island is connected with two side ribs through connecting ribs on two sides, and fourteen outer pins are respectively arranged on two sides of the slide island. The outer pins are connected between the two side ribs through the middle rib, the inner ends of all the outer pins bend and extend towards the direction of the slide island, so that the inner ends of all the outer pins wrap the periphery of the slide island, one end, close to the slide island, of each outer pin is provided with a bonding area, the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island, and the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island. The length of the bonding wire can be reduced, the bonding cost is saved, the risk of fractur</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAL9g9QyElNTFFIK0rMTeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBubGhqaGlqGhxkQpAgBZSh6Y</recordid><startdate>20240405</startdate><enddate>20240405</enddate><creator>SHAO JIMING</creator><creator>YUAN HONGCHENG</creator><scope>EVB</scope></search><sort><creationdate>20240405</creationdate><title>SOP lead frame</title><author>SHAO JIMING ; YUAN HONGCHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220731519UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAO JIMING</creatorcontrib><creatorcontrib>YUAN HONGCHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAO JIMING</au><au>YUAN HONGCHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOP lead frame</title><date>2024-04-05</date><risdate>2024</risdate><abstract>The utility model relates to an SOP lead frame, which comprises side ribs on two sides, a plurality of lead frame units are connected between the side ribs, each lead frame unit comprises a middle slide island, the slide island is connected with two side ribs through connecting ribs on two sides, and fourteen outer pins are respectively arranged on two sides of the slide island. The outer pins are connected between the two side ribs through the middle rib, the inner ends of all the outer pins bend and extend towards the direction of the slide island, so that the inner ends of all the outer pins wrap the periphery of the slide island, one end, close to the slide island, of each outer pin is provided with a bonding area, the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island, and the inner ends of all the outer pins of the SOP lead frame wrap the periphery of the slide island. The length of the bonding wire can be reduced, the bonding cost is saved, the risk of fractur</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SOP lead frame
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T05%3A00%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAO%20JIMING&rft.date=2024-04-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220731519UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true