Wafer demolding device and automatic wafer demolding equipment

The utility model discloses a wafer demoulding device, which comprises a central support table and an adsorption disc, one side of the adsorption disc facing a crystal carrying film is a working surface, and the adsorption disc is provided with at least one air hole used for generating negative pressure on the working surface; the clamping mechanism is arranged on the outer ring of the central supporting table in a surrounding manner and is used for clamping the outer ring of the crystal carrying film carrying the wafer; the lifting mechanism is connected with the clamping mechanism or the central supporting table; the lifting mechanism drives the clamping mechanism to move relative to the central supporting table so as to cover and press a crystal carrying film carrying a wafer on the clamping mechanism onto the adsorption disc for tiling and stretching, negative pressure is generated at the air holes in the adsorption disc so that a negative pressure state is also formed between the crystal carrying film an